SOD-323型双端器件焊点防开裂技术研究  

Research on Preventing Solder Joint Cracking Technology of SOD-323 Device

作　　者：姜冬怡 张纯亚 黄吉 JIANG Dongyi;ZHANG Chunya;HUANG Ji(The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2022年第5期843-847,共5页Microelectronics

基　　金：模拟集成电路国家级重点实验室基金资助项目(6142802040805)。

摘　　要：针对某电源模块产品中的SOD-323型双端器件在环境试验中出现焊点开裂的失效问题,对其焊点开裂机理进行研究。结合三防漆的温度特性,对其进行仿真和多种条件下的应力试验摸底。根据试验结果,提出了针对SOD-323型双端器件焊点开裂的应用解决方案。For the problem of solder joint cracking in the environmental test of the SOD-323 double-end device in a power supply product, the mechanism of solder joint cracking was studied. Combining with the temperature characteristics of Three-proofing Lacquer, simulation and stress tests under various conditions were carried out. According to the test results, the reliability application solution for the SOD-323 double-end device is proposed.

关 键 词：电源模块 SOD-323 双端器件 焊点开裂 可靠性 

分 类 号：TN86[电子电信—信息与通信工程]