Cortical Bone Model with a Microcrack under Tensile Loading  

作　　者：WANG Xu CHEN Yaogeng DING Shenghu WANG Wenshuai LI Xing 

机构地区：[1]School of Mathematics and Statistics,Ningxia University,Yinchuan 750021,Ningxia,China [2]School of Science,Ningxia Medical University,Yinchuan 750004,Ningxia,China

出　　处：《Wuhan University Journal of Natural Sciences》2022年第5期375-382,共8页武汉大学学报（自然科学英文版）

基　　金：Supported by the National Natural Science Foundation of China(82060331,12062021,12062022);the Natural Science Foundation of Ningxia(2021AAC03028,2022AAC03001)。

摘　　要：The fracture mechanics of cortical bone has received much attention in biomedical engineering.It is a fundamental question how the material constants and the geometric parameters of the cortical bone affect the fracture behavior of the cortical bone.In this work,the plane problem for cortical bone with a microcrack located in the interstitial tissue under tensile loading was considered.Using the solution for the continuously distributed edge dislocations as Green ’ s functions,the problem was formulated as singular integral equations with Cauchy kernels.The numerical results suggest that a soft osteon promotes microcrack propagation,while a stiff osteon repels it,but the interaction effect between the microcrack and the osteon is limited near the osteon.This study not only sheds light on the fracture mechanics behavior of cortical bone but also offers inspiration for the design of bioinspired materials in biomedical engineering.

关 键 词：cortical bone MICROCRACK singular integral equation Cauchy kernel stress intensity factor 

分 类 号：O175.5[理学—数学]