Computational Modeling of Intergranular Crack Propagation in an Intermetallic Compound Layer  

作　　者：Tong An Rui Zhou Fei Qin Pei Chen Yanwei Dai Yanpeng Gong 

机构地区：[1]Institute of Electronics Packaging Technology and Reliability,Faculty of Materials andManufacturing,Beijing University of Technology,Beijing,100124,China [2]Beijing Key Laboratory of Advanced Manufacturing Technology,Beijing University of Technology,Beijing,100124,China

出　　处：《Computer Modeling in Engineering & Sciences》2023年第5期1481-1502,共22页工程与科学中的计算机建模（英文）

基　　金：supported by the NationalNatural Science Foundation of China (NSFC) under Grant 11872078,and Beijing Natural Science Foundation No.3222005.

摘　　要：A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds(IMCs)in solder joints.The effects of the grain aggregate morphology,the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated.The overall strength is predominantly determined by the weak grain interfaces;both the grain aggregate morphology and the weak grain interfaces control the crack configuration;the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining the macroscopic mechanical response of the system.

关 键 词：Cohesive zone element intergranular cracking polycrystalline material intermetallic compound(IMC) 

分 类 号：TG1[金属学及工艺—金属学]