多功能红外焦平面读出电路设计  

Design of multifunctional infrared FPA ROIC

作　　者：郑丽霞 刘高龙 吴金 孙伟锋[2] Zheng Lixia;Liu Gaolong;Wu Jin;Sun Weifeng(Institute of Microelectronics,Southeast University,Nanjing 210096,China;School of Electronic Science&Engineering,Southeast University,Nanjing 210096,China)

机构地区：[1]东南大学微电子学院,江苏南京210096 [2]东南大学电子科学与工程学院,江苏南京210096

出　　处：《红外与激光工程》2022年第12期83-89,共7页Infrared and Laser Engineering

基　　金：国家自然科学基金(62174028);江苏省自然科学基金(BK20211046)。

摘　　要：主/被动成像系统具备多种成像模式,集成度高、成本低、系统运行效率高,应用前景良好。设计了一种64×64规模的多功能红外焦平面阵列读出电路,在30μm像元中心距的限制下实现了日光标准成像、微光成像、异步激光脉冲检测和二维激光测距四种成像功能。基于TSMC 0.35μm工艺,完成了多功能读出电路的芯片设计与流片验证。电路复用设计和像素共享架构显著降低了版图面积。CTIA的T型开关有效减小漏电流,改善了红外被动成像电路的动态范围,高增益模式下动态范围达60dB,低增益模式下动态范围达68dB。并且满阱电荷容量分别为203ke^(-)和1.63Me^(-)。三级pushpull运放和MOS反馈电阻使RTIA兼具高增益和小尺寸。芯片测试结果表明,电路具备主/被动成像功能,性能良好,可应用于红外焦平面激光雷达成像系统。The active/passive imaging system has two imaging modes,with high integration,low cost,high system operation efficiency and good application prospect.A 64×64 multifunctional infrared focal plane array(FPA)readout integrated circuit(ROIC)was presented.Under the limitation of 30μm pixel center distance,four imaging functions had been realized on this ROIC:Daylight standard imaging,low light level imaging,asynchronous laser pulse detection and two-dimensional laser ranging.Based on the TSMC 0.35μm process,the chip design,tape out and test verification of multifunctional ROIC were completed.The layout area was significantly reduced by using circuit reuse design and pixel sharing architecture.The T-switch of CTIA was adopted to effectively reduce the leakage current and to improve the dynamic range of infrared passive imaging circuit,which made the dynamic range up to 60 dB in high gain mode and 68 dB in low gain mode.And the well capacity reached 203ke^(-) in high gain mode and 1.63Me^(-) in low gain mode.Three-stage push-pull amplifier and MOS feedback resistor made RTIA have both high gain and small layout area.The test results show that the circuit has active/passive imaging functions and good performances.It can be applied to infrared FPA lidar imaging system.

关 键 词：读出电路 红外热成像 激光主动成像 主被动成像 

分 类 号：TN492[电子电信—微电子学与固体电子学]