高弥散型AgZnO触头材料的制备  

Preparation of AgZnO Contact Material With High Dispersion

作　　者：曹庆 张秀芳 杨昌麟 柏小平 颜小芳 金扬灯 CAO Qing;ZHANG Xiufang;YANG Changling;BAI Xiaoping;YAN Xiaofang;JIN Yangdeng(Zhejiang Fuda Alloy Material Technology Co.,Ltd.,Zhejiang WenZhou 325000,China)

机构地区：[1]浙江福达合金材料科技有限公司,浙江温州325025

出　　处：《电工材料》2023年第1期11-13,17,共4页Electrical Engineering Materials

摘　　要：采用机械混粉法和超声分散法制备AgZnO材料,分析了不同制备工艺条件下,AgZnO触头材料显微组织和性能的变化。结果表明:超声分散法制备AgZnO材料的颗粒细小、分散均匀,基体结合强度较高;与机械混粉法制备AgZnO相比,超声分散法制备AgZnO材料密度、硬度较高,电阻率较低,综合性能较佳。AgZnO powders were prepared by mechanical powder-mixing and Ultrasonic dispersion methods. Microstructures and properties of AgZnO fabricated by different technologies were studied. The results show that the more uniform microstructure and the higher bonding strength were obtained when prepared by Ultrasonic dispersion. Compared to mechanical powder-mixing process, AgZnO contact material with higher density and hardness, lower electric resistivity was fabricated by Ultrasonic-mixing process.

关 键 词：AgZnO触头材料 制备工艺 性能 继电器 

分 类 号：TM503.5[电气工程—电器]