基于ANSYS的智能手机缓冲包装优化设计  

Optimized Design of Smartphone Buffer Packaging Based on ANSYS

作　　者：沈姣 汪军[1] 王刚[2] 孟令伟[2] SHEN Jiao;WANG Jun;WANG Gang;MENG Ling-wei(Wuxi Branch,Special Equipment Safety Supervision Inspection Institute of Jiangsu Province,Wuxi 214000,China;Heilongjiang Bayi Agricultural University,Daqing 163319,China)

机构地区：[1]江苏省特种设备安全监督检验研究院无锡分院,江苏无锡214000 [2]黑龙江八一农垦大学,黑龙江大庆163319

出　　处：《机械工程与自动化》2023年第1期97-99,共3页Mechanical Engineering & Automation

摘　　要：在现有手机缓冲包装结构的基础上,选择不同材质和厚度的缓冲衬垫材料,利用ANSYS/SpaceClaim模块对包装件进行建模,利用LS-DYNA模块进行跌落仿真。仿真结果表明:所选制作缓冲衬垫材料中最优的是定量为350 g/m^(2)、厚度为0.415 mm的白纸板,其对应的手机屏幕最大冲击加速度为136.79 m/s^(2)。On the basis of the existing phone cushion packaging structure, the cushioning pad material of different materials and thicknesses is selected, the packaging is modeled by using the ANSYS/SpaceClaim module, and the LS-DYNA module is used for drop simulation. The simulation results show that the optimal cushioning material selected for this paper is a white cardboard with a quantitative ratio of 350 g/m^(2) and a thickness of 0.415 mm, which corresponds to the maximum impact acceleration of the smartphone screen of 136.79 m/s^(2).

关 键 词：智能手机 ANSYS 缓冲包装 设计 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术]