一种新式半导体扩散炉的结构设计分析  

Structural Design and Analysis ofa New Semiconductor Diffusion Furnace

作　　者：杨志伟 YANG Zhiwei(School of Intelligent Manufacturing,Jilin Vocational College of Industry and Technology,Jilin 132013,China)

机构地区：[1]吉林工业职业技术学院智能制造学院,吉林吉林132013

出　　处：《技术与教育》2022年第3期29-32,共4页Technique & Education

摘　　要：为提升扩散炉的使用寿命以及扩散炉的温度准确性,从而提升半导体芯片质量,设计了一种新式半导体扩散炉的结构,该半导体扩散炉主要在传统扩散炉基础上增设了分别在横纵两个维度排布的石英管旋转装置和立体多功能热电偶。In order to improve the service life of the diffusion furnace and the temperature accuracy of the diffusion furnace,a new structure of the semiconductor diffusion furnace is designed to improve the quality of the semiconductor chip.The semiconductor diffusion furnace is mainly based on the traditional diffusion furnace,and a quartz tube rotating device and a three-dimensional multi-function thermocouple are added,which are respectively arranged in the horizontal and vertical dimensions.

关 键 词：半导体扩散炉 石英管 旋转装置 热电偶 

分 类 号：TK175[动力工程及工程热物理—热能工程]