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作 者:王欣 刘谨洋 杜赞纯 刘向阳[1] 王旭[1] WANG Xin;LIU Jinyang;DU Zanchun;LIU Xiangyang;WANG Xu(College of Polymer Science and Engineering,Sichuan University,Chengdu 610042,China)
机构地区:[1]四川大学高分子科学与工程学院,四川成都610042
出 处:《绝缘材料》2023年第2期11-18,共8页Insulating Materials
基 金:国家重点研发计划项目(2022YFB3806903);国家自然科学基金资助项目(51803129;52173008)
摘 要:便携式电子设备的发展对于高导热和电绝缘的热管理材料需求越来越大,氟化石墨烯(FG)作为一种新兴的具有高热导率及电绝缘性的导热填料受到了科学界的广泛关注。本文总结了FG的制备方法、结构与性能关系等,特别对FG的导热机理进行了分析,同时系统阐述了FG作为功能填料复合改性聚酰亚胺(PI)的最新研究进展,并对存在的问题和挑战进行了总结和展望。With the development of portable electronic devices, there is an increasing demand for thermal management materials with high thermal conductivity and electrical insulation. As a new thermal conductive filler with high conductivity and insulating property, fluorinated graphene(FG) has received extensive attention from the scientific community. In this paper, the preparation method of FG and the relationship between its structure and properties were summarized, the thermal conducting mechanism of FG was analyzed especially, and the latest research progress of FG as functional filler composite modified polyimide(PI) was systematically described. The problems and challenges were summarized and prospected.
分 类 号:TM215[一般工业技术—材料科学与工程]
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