聚酰胺酸低黏化制备导热BN/PI复合薄膜  

Preparation of thermally conductive BN/PI composite films by low-viscosity poly(amic acid)

作　　者：高梦岩 庞淇 翟磊[1] 王畅鸥 贾妍 莫松[1] 何民辉[1] 范琳[1,2] GAO Mengyan;PANG Qi;ZHAI Lei;WANG Chang’ou;JIA Yan;MO Song;HE Minhui;FAN Lin(Key Laboratory of Science and Technology on High-tech Polymer Materials,Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190,China;School of Chemical Sciences,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院化学研究所极端环境高分子材料重点实验室,北京100190 [2]中国科学院大学化学科学学院,北京100049

出　　处：《绝缘材料》2023年第2期46-53,共8页Insulating Materials

基　　金：北京市自然科学基金资助项目(2202068)。

摘　　要：为解决填料在高黏度聚酰胺酸(PAA)中易团聚、分散性差的问题,本研究以3,3′,4,4′-联苯四甲酸二酐(BPDA)和对苯二胺(PDA)为原料,采用酸酐水解法在较高固含量下合成了低黏度的聚酰胺酸溶液。在此基础上,通过填料的液相法超声分散预处理和高效球磨混合工艺,制备了氮化硼质量分数为0~40%的氮化硼/聚酰亚胺(BN/PI)复合薄膜,系统考察了填料的分散性以及复合薄膜的力学、耐热、导热等性能。结果表明:聚酰胺酸的低黏化及填料混合分散工艺赋予了填料良好的分散性,并对BN/PI复合薄膜的性能产生重要影响。当填料质量分数为40%时,复合薄膜的力学强度约为140 MPa,玻璃化转变温度为385.2℃,导热系数高达0.741 W/(m·K),相比无填料添加的纯PI膜提高了338%。In order to solve the problem of agglomeration and poor dispersion of fillers in high-viscosity poly(amic acid)(PAA), we prepared PAA solution with low viscosity by anhydride hydrolysis method using PAA solution of 3, 3’, 4, 4’-biphenyltetracarboxylic dianhydride(BPDA) and p-phenylenediamine(PDA) under a high solid content. On this basis,boron nitride/polyimide(BN/PI) composite films with the mass fraction of BN ranging from 0 to 40% were prepared by ultrasonic pulverization pretreatment and high-efficiency ball milling mixing process. The dispersion of fillers and the mechanical properties, heat resistance and thermal conductivity of composite films were systematically investigated. The results show that the low viscosity of PAA and the mixing process improve the dispersibility of fillers and have an important impact on the properties of BN/PI composite films. When the mass fraction of filler is 40%, the tensile strength of the composite film is about 140 MPa, the glass transition temperature is 385.2℃. The maximum thermal conductivity is up to 0.741 W/(m·K), which is 338% higher than that of pure polyimide film.

关 键 词：聚酰亚胺 氮化硼 分散性 复合薄膜 导热性能 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]