短针PGA器件波峰焊接后故障分析  

Failure Analysis of Short-lead PGA Devices after Wave Soldering

作　　者：徐朱力 王珂 刘瑜 黄伟 陈敦良 刘沛鑫 XU Zhuli;WANG Ke;LIU Yu;HUANG Wei;CHEN Dunliang;LIU Peixin(Shanghai Institute of Space Power-Sources,Shanghai 200245,China)

机构地区：[1]上海空间电源研究所,上海200245

出　　处：《电子工艺技术》2023年第1期9-13,共5页Electronics Process Technology

摘　　要：针对某型号短针PGA器件经波峰焊接后焊点故障进行分析,通过验证工艺参数对通孔透锡率、焊接合金层的影响,进一步识别焊接风险项,确定了造成焊接缺陷的主要原因,最终确保了短针PGA器件的可靠装联。The solder joint failure of a certain type of short-lead PGA devices after wave soldering is analyzed, and the soldering risk items are further identified by verifying the influence of process parameters on the through-hole filling rate and IMC. The main causes of soldering defects are determined, and the reliable assembly for the devices is finally ensured.

关 键 词：PGA短针 波峰焊 焊点分析 

分 类 号：TN405[电子电信—微电子学与固体电子学]