倒装贴装机荷重控制的优化改进  

Optimization and Improvement of Load Control for Flip Mounting Machine

作　　者：黄云龙 HUANG Yunlong(Dalian Jafeng Automation Co.,Ltd.,Dalian 116041,China)

机构地区：[1]大连佳峰自动化股份有限公司,辽宁大连116041

出　　处：《电子工艺技术》2023年第1期53-56,共4页Electronics Process Technology

摘　　要：高精度自动倒装贴装机是倒装焊工艺发展起来的新的微电子后封装设备。荷重是贴装机的关键因素之一,是控制质量的关键。简要介绍了高精度自动倒装贴装机荷重控制的重要性及系统结构和实现过程。为了提高倒装贴装机贴片质量并保证UPH,在高速高加速度的运行条件下,实现贴装机荷重的小超调、稳定和精确控制贴片机荷重的优化。The high precision automatic flip mounting machine is a new microelectronic post-packaging equipment developed from the flip welding process. The load is one of the key factors of mounting machine and the key of quality control. The high precision automatic flip on the importance of load control capacity is briefly introduced, the system structure and implementation process are expounded. In order to improve the flip chip installed patches of quality and ensure the UPH, under the condition of high speed high acceleration run, the optimization of small overshoot, stable and precise control of the mounting machine load is realized.

关 键 词：倒装贴装机 荷重 小超调 标定 

分 类 号：TN305[电子电信—物理电子学]