聚酰亚胺薄膜湿热老化性能研究  

Study on Hygrothermal Aging Properties of Polyimide Films

作　　者：陶君 Tao Jun(Shanghai Intelligent Service and Technology Co.Ltd.,Shanghai 201206,China)

机构地区：[1]上海缆慧检测技术有限公司,上海201206

出　　处：《工程塑料应用》2023年第1期98-103,共6页Engineering Plastics Application

摘　　要：由于聚酰亚胺(PI)材料的电绝缘性在受到湿热老化的破坏后会出现性能下降的趋势,因此有必要对湿热老化的PI材料的电学性能等进行探究,进而对其性能变化进行合理的分析和解释。通过85℃和85%湿度老化(双85老化)研究和分析了聚酰亚胺薄膜在不同湿热老化时间下的力学性能和电绝缘性能的变化规律。结果表明:PI材料断裂伸长率随湿热老化时间的增加,在360 h以前下降幅度较大,随后下降缓慢;介质损耗因数随着湿热老化时间的增加呈增大趋势;击穿场强随着湿热老化时间的增加逐渐降低,而湿热老化600 h和720 h样品的击穿场强降低幅度较大;热失重分析结果表明,初始分解温度、最大分解温度和残炭量均呈下降趋势,但降低幅度较小。The electric properties of polyimide(PI) would deteriorate with time under the condition of hydrothermal aging.Therefore,it is necessary to explore the electrical properties of the PI materials at varied aging conditions,and then make reasonable analysis and explanation of their changes. As revealed,the mechanical properties and electrical insulation properties of PI materials under different hydrothermal aging time(85 ℃ and 85% humidity) were studied and analyzed. The results show that the elongation at break decreases greatly before 360 h and then slowly with the aging time increases. The dielectric loss factor increases with the increase of hydrothermal aging time,which is in consistent with trend of the breakdown field strength. Besides,the breakdown field strength decreases greatly when the aging time at 600 h and 720 h. Furthermore,the results of thermogravimetric analysis indicates that the initial decomposition temperature,maximum decomposition temperature and carbon residue decrease slightly with the aging time prolong.

关 键 词：聚酰亚胺 湿热老化 介电频谱 击穿场强 力学性能 

分 类 号：TQ320.7[化学工程—合成树脂塑料工业]