基于SPS工艺制备的W-25 mass%Cu复合材料的组织与性能  

Microstructure and properties of W-25 mass%Cu composites prepared by SPS process

作　　者：段俊彪 国秀花[1] 皇涛 宋克兴[1,2] 冯江 王旭[1] DUAN Jun-biao;GUO Xiu-hua;HUANG Tao;SONG Ke-xing;FENG Jiang;WANG Xu(Key Laboratory of Nonferrous Metal Materials Science and Processing Technology of Henan Province,School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Henan Provincial Academy of Sciences,Zhengzhou 450052,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南省有色金属材料科学与加工技术重点实验室,河南洛阳471023 [2]河南省科学院,河南郑州450052

出　　处：《材料热处理学报》2023年第2期37-45,共9页Transactions of Materials and Heat Treatment

基　　金：河南省科技攻关计划项目(212102210110);河南省高等学校青年骨干教师培养计划项目(2018GGJS045);中国工程科技发展战略河南研究院战略咨询研究项目(2021HENZDA02)。

摘　　要：采用放电等离子烧结(SPS)制备了W-25 mass%Cu复合材料,研究了烧结温度(900、950、1000、1050℃)对W-25 mass%Cu复合材料微观组织和性能的影响规律,重点研究了其耐电弧烧蚀行为。结果表明:采用SPS工艺制备的W-25 mass%Cu复合材料的组织分布均匀;随着烧结温度的升高,复合材料的致密度、导电率和硬度呈现出先增加后减小的趋势。当烧结温度为1000℃时,W-25 mass%Cu复合材料的综合性能最佳,其致密度、导电率和硬度最高,分别为96.7%、42.86%IACS和205.5 HB;压缩强度和断裂应变取得最大值,分别是875 MPa和26%。W颗粒的动力学生长行为研究结果表明晶格扩散是W颗粒长大的主导机制。在电弧烧蚀过程中,随着烧结温度的升高,W-25 mass%Cu复合材料表面的侵蚀区域先变小后增大、烧蚀坑逐渐变浅、烧蚀坑直径变宽。与900℃烧结制备的W-25 mass%Cu复合材料相比,1000℃烧结制备的W-25 mass%Cu复合材料的烧蚀坑直径扩大了47.3%,烧蚀坑深度降低了50%。W-25 mass%Cu composites were prepared by spark plasma sintering(SPS).The effect of sintering temperature(900,950,1000 and 1050℃)on microstructure and properties of the W-25 mass%Cu composites was studied,and its arc ablation resistance was emphatically studied.The results show that the microstructure of the W-25 mass%Cu composites prepared by SPS process is uniform;with the increase of sintering temperature,the density,conductivity and hardness of the composites increase first and then decrease.When the sintering temperature is 1000℃,the comprehensive properties of the W-25 mass%Cu composites are the best,its density,conductivity and hardness are the highest,which are 96.7%,42.86%IACS and 205.5 HB respectively,and the compressive strength and fracture strain reach the maximum values of 875 MPa and 26%,respectively.The results of dynamic growth behavior of W particles show that lattice diffusion is the dominant mechanism of W particle growth.In the process of arc ablation,with the increase of sintering temperature,the erosion area on the surface of the W-25 mass%Cu composites becomes smaller first and then larger,and the ablation pits gradually become shallower and wider in diameter.Compared with the W-25 mass%Cu composites sintered at 900℃,the ablation pit diameter of the W-25 mass%Cu composites sintered at 1000℃increases by 47.3%,and the ablation pit depth decreases by 50%.

关 键 词：W-25 mass%Cu复合材料 微观组织 烧结动力学 致密度 耐电弧烧蚀性能 

分 类 号：TB333[一般工业技术—材料科学与工程]