施镀时间对SiCp/Al复合材料化学镀Ni-P镀层的影响  

Effect of plating time on electroless Ni-P coating of SiCp/Al matrix composites

作　　者：李卓[1] 坚增运[1] 田梅娟 Li Zhuo;Jian Zengyun;Tian Meijuan(The Shanxi Key Laboratory of Photoelectric Functional Materials and Devices,Xi’an Technological University,Xi’an 710021,China;College of Chemistry and Chemical Engineering,Baoji University of Arts and Science,Baoji 721013,China)

机构地区：[1]西安工业大学光电功能材料与器件陕西省重点实验室,陕西西安710021 [2]宝鸡文理学院化学化工学院,陕西宝鸡721013

出　　处：《电镀与精饰》2023年第2期65-71,共7页Plating & Finishing

基　　金：国家自然科学基金(51671166)。

摘　　要：采用化学镀的方法在激光选区熔化(SLM)技术成型的SiCp/Al复合材料表面制备了Ni-P镀层,研究了施镀时间对镀层的表面形貌、截面厚度、沉积速率、相结构和显微硬度的影响。结果表明:化学镀0.5~12 h时,镀层都呈胞状形貌,且呈非晶态结构,为高磷镀层;随着施镀时间的延长,胞状组织逐渐变大,表面逐渐致密,镀层厚度逐渐增大,但增长速率越来越小,显微硬度先增大后趋于稳定。施镀时间为8 h时的镀层表面平整、致密、连续,厚度可达100μm,显微硬度为653.4 HV,镀层与基体结合强度为77.2 N。Electroless Ni-P coating was prepared on the surface of SiCp/Al matrix composites by selective laser melting(SLM).The effects of electroless plating time on the microstructure,thickness,deposition rate,phase structure and microhardness of the coating were studied.The results show that the electroless plating coating is cellular morphology,amorphous structure and high phosphorus coating at 0.5-12 h.With the extension of plating time,the cellular structure becomes larger,the surface becomes denser and the thickness of the coating increases gradually,but the growth rate becomes smaller and smaller,and the microhardness first increases and then tends to be stable.When the plating time is 8 h,the surface of the coating is smooth,dense and continuous,the thickness can reach 100μm,the micro-hardness is 653.4 HV,and the bonding strength between the coating and the substrate is 77.2 N.

关 键 词：化学镀NI-P SICP/AL复合材料 化学镀时间 硬度 

分 类 号：TG111.4[金属学及工艺—物理冶金]