微电子表面贴装关键技术与装备分析  

Microelectronics Surface Mount Key Technology and Equipment

作　　者：王飞 Wang Fei(Guodian Nanrui Technology Co.,Ltd.,Nanjing Jiangsu 210000)

机构地区：[1]国电南瑞科技股份有限公司,江苏南京210000

出　　处：《现代工业经济和信息化》2023年第1期98-100,共3页Modern Industrial Economy and Informationization

摘　　要：近年来,表面贴装技术以提高产品质量和性能,以及降低成本的特点,在消费类电子产品和军事电子产品领域得到广泛影响,这也推动着电子产品的变革。介绍了微电子表面贴装技术的流程和装备,分析了微电子表面贴装技术三大关键工序,从生产现场和生产标准两个方面研究了微电子表面贴装技术的质量控制措施,该技术可以提高电子产品的生产效率和生产质量。In recent years,surface mount technology has been widely influenced in the field of consumer electronics and military electronics with the characteristics of improving product quality and performance as well as reducing cost,which is also driving the change of electronic products.The process and equipment of microelectronic surface mount technology are introduced,the three key processes of microelectronic surface mount technology are analyzed,and the quality control measures of microelectronic surface mount technology are studied from two aspects of production site and production standard,and the technology can improve the production efficiency and production quality of electronic products.

关 键 词：微电子 表面贴装技术 装备 

分 类 号：TN405[电子电信—微电子学与固体电子学]