陶瓷材料电场辅助连接技术研究现状及发展趋势  

Electric-field Assisted Joining Technology for the Ceramics Materials:Current Status and Development Trend

作　　者：刘岩[1] 张珂颖 李天宇 周菠 刘学建[1] 黄政仁[1] LIU Yan;ZHANG Keying;LI Tianyu;ZHOU Bo;LIU Xuejian;HUANG Zhengren(Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 200050,China;Center of Materials Science andOptoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院上海硅酸盐研究所,上海200050 [2]中国科学院大学材料科学与光电工程中心,北京100049

出　　处：《无机材料学报》2023年第2期113-124,共12页Journal of Inorganic Materials

基　　金：国家自然科学基金(51972320)。

摘　　要：陶瓷材料因具有良好的机械性能、抗腐蚀性、耐高温性及抗氧化性等,被广泛应用于航空航天、医疗、能源交通等领域,陶瓷材料自身及其与金属材料的连接技术对于实际工程应用具有重要意义。由于部分陶瓷材料与电场的特殊作用机理,将外加电场应用于陶瓷材料的连接技术中,可以获得多种普通连接技术所不具备的优势,如连接温度较低和连接时间较短等,这就催生了新型陶瓷材料电场辅助连接技术。本文着重梳理了陶瓷及陶瓷基复合材料电场辅助连接技术的研究现状,对近年来电场辅助连接技术的研究进展进行了综述,重点介绍了电场辅助扩散连接(Electric field-assisted diffusion bonding,FDB)技术、放电等离子体烧结(Spark plasma sintering,SPS)连接技术以及新型低温快速闪连接(Flash joining,FJ)技术的连接机理、典型界面微观结构、接头强度及影响因素等,阐述了不同电场辅助连接技术的适用范围和局限性,并对陶瓷材料电场辅助连接技术的发展进行了展望。Ceramic materials are widely used in aerospace,medicine and energy transportation concerned for their excellent over-all mechanical and chemical properties,such as corrosion resistance,high temperature resistance and oxidation resistance.Especially,joining ceramic materials themselves and connecting them with metals are of great significance for the practical engineering applications.Compared with traditional joining technology,electric-assisted joining technology possesses a variety of advantages,such as low temperature and short time,owing to the special influence of the electric field on some ceramic materials.This paper focuses on the development of the electric-field assisted joining technologies of ceramics and ceramic matrix composites,and summarizes their research status in recent years.From the views of joining mechanism,typical interface microstructure and joint strength and influencing factors,the electric-field assisted diffusion bonding(FDB),spark plasma sintering(SPS)joining,and the new low-temperature rapid flash joining(FJ)are reviewed.Moreover,the applicable scope and limitations of different electric-field assisted joining technologies are expounded.In addition,the development trend of the electric-field assisted joining technology of ceramic materials is prospected.

关 键 词：陶瓷 电场 电场辅助扩散连接 SPS连接 闪连接 综述 

分 类 号：TQ174[化学工程—陶瓷工业]