冷烧结技术的研究现状及发展趋势  

Current Status and Development Trend of Cold Sintering Process

作　　者：冯静静 章游然 马名生[1] 陆毅青[1] 刘志甫[1,2] FENG Jingjing;ZHANG Youran;MA Mingsheng;LU Yiqing;LIU Zhifu(Key Laboratory of Inorganic Functional Materials and Devices,Shanghai Institute of Ceramics,Chinese Academy ofSciences,Shanghai 201899,China;College of Materials Science and Opto-Electronic Technology,University of ChineseAcademy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院上海硅酸盐研究所,中科院无机功能材料与器件重点实验室,上海201899 [2]中国科学院大学材料科学与光电技术学院,北京100049

出　　处：《无机材料学报》2023年第2期125-136,共12页Journal of Inorganic Materials

基　　金：中国博士后科学基金(2021M693264);国家自然科学基金(61871369)。

摘　　要：采用常规热烧结实现陶瓷粉体的致密化,烧结温度通常超过1000℃,这不仅需要消耗大量能源,还会使一些陶瓷材料在物相稳定性、晶界控制以及与金属电极共烧等方面面临挑战。近年来提出的冷烧结技术(Cold Sintering Process,CSP)可将烧结温度降低至400℃以下,利用液相形式的瞬态溶剂和单轴压力,通过陶瓷颗粒的溶解-沉淀过程实现陶瓷材料的快速致密化。冷烧结技术具有烧结温度低和时间短等特点,自开发以来受到广泛关注,目前已应用于近百种陶瓷及陶瓷基复合材料,涉及电介质材料、半导体材料、压敏材料和固态电解质材料等。本文介绍了冷烧结技术的发展历程、工艺技术及其致密化机理,对其在陶瓷材料及陶瓷-聚合物复合材料领域的研究现状进行了综述,其中根据溶解性的差异主要介绍了Li2MoO4陶瓷、ZnO陶瓷和BaTiO3陶瓷的冷烧结现状。针对冷烧结技术工艺压力高的问题及可能的解决途径进行了探讨,并对冷烧结技术未来的发展趋势进行了展望。Densification of ceramic materials by conventional sintering process usually requires a high temperature over 1000℃,which not only consumes a lot of energy,but also forces some ceramic materials to face challenges in phase stability,grain boundary control,and co-firing with metal electrodes.In recent years,an extremely low temperature sintering technique named cold sintering process(CSP)was proposed,which can reduce the sintering temperature to below 400℃,and realize the rapid densification of ceramic materials through the dissolutionprecipitation process of ceramic particles by using the transient solvent in liquid phase and uniaxial pressure.The advantages of CSP,including low sintering temperature and short sintering time,have attracted extensive attention from researchers,since it was firstly reported in 2016.At present,CSP has been applied to the sintering of nearly 100kinds of ceramics and ceramic-matrix composites,involving dielectric materials,semiconductor materials,pressure-sensitive materials,and solid-state electrolyte materials.This paper firstly introduces the low-temperature sintering techniques’development history,process and densification mechanism.Then,application of CSP in the field of ceramic materials and ceramic-polymer composites is summarized.Based on differences of solubility,application of CSP mainly on Li2MoO4ceramics,ZnO ceramics,BaTiO3ceramics,and their composites preparations are introduced.Auxiliary effect of the transient solvent on cold sintering process is emphatically analyzed.Moreover,the high pressure issue in the cold sintering process and the possible solutions are discussed.At last,future development trend of cold sintering process is prospected.

关 键 词：冷烧结技术 陶瓷 复合材料 溶剂 综述 

分 类 号：TQ174[化学工程—陶瓷工业]