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作 者:林驰皓 胡可 王明辉 雷久淮 林波[1] LIN Chihao;HU Ke;WANG Minghui;LEI Jiuhuai;LIN Bo(School of Mechanical Engineering,Guizhou University,Guiyang 550025,China;Institute of New Materials,Guangdong Academy of Sciences,Guangzhou 510650,China;National Engineering Research Center of Powder Metallurgy of Titanium&Rare metals,Guangzhou 510650,China;Huyuan Provincial Academy of Sciences Research Institute,Guangdong Academy of Sciences,Heyuan 517099,China)
机构地区:[1]贵州大学机械工程学院,贵州贵阳550025 [2]广东省科学院新材料研究所,广东广州510650 [3]国家钛及稀有金属粉末冶金工程技术研究中心,广东广州510650 [4]河源市省科院研究院,广东河源517099
出 处:《粉末冶金工业》2023年第1期24-30,共7页Powder Metallurgy Industry
基 金:广东省自然科学基金资助项目(2021A1515010470);广东省科学院建设国内一流研究机构行动专项资金项目(2021GDASYL-20210302008、2019GDASYL-0105077)。
摘 要:采用金属注射成形(MIM)技术制备了钨铜合金,定量表征了铜粉的粉末粒度和粒形,重点研究了铜粉粒度和粒形对MIM钨铜合金组织与性能的影响。通过对比铜粉的粒径、粒度分布宽度、长宽比、粗糙度、赘生物指数和钝度等特征参数,破碎铜粉与水雾化铜粉颗粒呈枝晶状,粒径远小于还原铜粉,但破碎铜粉粒度分布宽,微观结构上的规则度、表面光滑程度以及分散程度最佳。破碎铜粉混合钨粉为原料,通过MIM技术制备钨铜注射生坯致密度高、缺陷少,烧结后钨铜合金的组织与性能最优,致密度为96.2%,硬度为235HV,抗弯强度为1200 MPa,热导率为128 W/(m·K),电导率为30%IACS。Metal injection molding(MIM)technology was adopted to prepare tungsten-copper alloy.Particle size and particle shape of the selected copper powders was quantitatively characterized by image analysis technology.The influence of the copper powders on the microstructure and properties of MIM tungsten-copper alloy was investigated in detail.By comparing,the characteristic parameters such as particle size,particle size distribution width,aspect ratio,roughness,outgrow and bluntness of the copper powders,the particle sizes of the crushed copper(CCu)powders and the water atomized copper(WCu)powders were much smaller than that of the reduced copper(RCu)powders,however the CCu powders exhibited wider particle size distribution and better regularity,surface smoothness and dispersion microstructure than the WCu powders and RCu powders.With tungsten powder blended with the CCu powders as raw materials,the tungsten-copper green parts were prepared by MIM showed high density and few defects.After sintering,the tungsten-copper alloy has the best microstructure and properties,with a density of 96.2%,a hardness of 235 HV,a bending strength of 1200 MPa,a thermal conductivity of 128 W/(m·K)and an electrical conductivity of 30%IACS.
分 类 号:TG146.411[一般工业技术—材料科学与工程]
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