液相烧结制备电力开关用W-7Cu-xNi合金微观组织及性能分析  

Microstructure and property analysis of W-7Cu-xNi alloy prepared by liquid phase sintering for power switch

作　　者：韩俊峰[1] 马越超 姜子明 HAN Junfeng;MA Yuechao;JIANG Ziming(Department of Electrical Engineering,Baotou Polytechnic,Baotou 014035,China;School of Energy and Power Engineering,Inner Mongolia University of Technology,Hohhot 010000,China;Power Engineering Technology Research Institute of Inner Mongolia Energy Power Generation Investment Group Co.,LTD,Hohhot 010000,China)

机构地区：[1]包头职业技术学院电气工程系,内蒙古包头014035 [2]内蒙古工业大学能源与动力工程学院,内蒙古呼和浩特010000 [3]内蒙古能源发电投资集团有限公司电力工程技术研究院,内蒙古呼和浩特010000

出　　处：《粉末冶金工业》2023年第1期84-88,共5页Powder Metallurgy Industry

基　　金：内蒙古教育厅产学研创新项目基金(NJCXY-19-025);内蒙古教育厅科研项目(NJZY18296,NJZY20350)。

摘　　要：为了提高电力开关用W-7Cu合金的综合性能,通过添加Ni元素方式对其进行加强,以液相烧结、机械球磨方式制备得到包含不同Ni含量的W-Cu合金。通过实验测试手段对其微观组织及物理性能进行了施压测试分析。研究结果表明:逐渐提高Ni含量后,形成了更大尺寸W颗粒,相邻颗粒间距降低。W-Cu-4%Ni合金界面形成更优润湿角,获得具有连续网状分布的Cu相,改善了W-Cu组织的分布均匀性,此时Ni元素已经完全与Cu相相溶。当Ni含量提高后,W-Cu合金获得了更大的硬度与致密度,热导率下降,相对密度增加。当加入4%的Ni时,致密度达到了95.6%,热导率从161 W/(m·K)降低为96.4 W/(m·K),获得了致密度更大合金。In order to improve the comprehensive properties of W-7Cu alloy used for power switch, the w-Cu alloy containing different Ni contents was prepared by liquid phase sintering and mechanical ball milling.The microstructure, phase structure, hardness and thermal conductivity were measured by electron microscope, X-ray diffractometer, hardness tester and laser thermal conductivity tester.The results show that the larger size W particles are formed and the spacing between adjacent particles decreases with the increase of Ni content.The interface of W-Cu-4%Ni alloy forms a better wettability angle and obtains a continuous network distribution of copper phase, which improves the distribution uniformity of W-Cu microstructure. At this time, Ni element is completely dissolved with Cu phase. With the increasing of Ni content, the hardness and density of W-Cu alloy are higher, the thermal conductivity decreases, and the relative density increases. When 4% Ni is added, the density reaches 95.6%, the thermal conductivity decreases from 161 W/(m·K) to 96. 4 W/(m·K), and the alloy with higher density is obtained.

关 键 词：W-Cu合金 活化烧结 组织结构 热导率 致密度 

分 类 号：TM564[电气工程—电器] TF125.241[冶金工程—粉末冶金]