基于Moldflow优化PCI-E连接器的翘曲  

Optimization of Warpage of PCI-E Connectors Based on Moldflow

作　　者：陈家达 姜苏俊 麦杰鸿 李珑 CHEN Jia-da;JIANG Su-jun;MAI Jie-hong;LI Long(Research and Development Center,Kingfa Science and Technology Co.,Ltd.,ZhuHai VanTeoue Specialty Engineering Plastics Co.,Ltd.,Guangdong Guangzhou 510520,China)

机构地区：[1]金发科技股份有限公司产品研发中心,珠海万通特种工程塑料有限公司,广东广州510520

出　　处：《广州化工》2022年第24期163-166,共4页GuangZhou Chemical Industry

摘　　要：借助Moldflow软件进行模拟仿真,分析玻纤增强材料注塑成型PCI-E连接器发生翘曲变形的趋势,并且从产品结构上去分析了产生这种趋势的原因。随后提出一种新的结构来改善现产品的翘曲问题,同时比对了不同玻纤含量和树脂基材对产品翘曲的影响。经结构改善和材料优化后的产品,在翘曲上达到预需目的。因此,本文的分析过程对弱化此类产品的翘曲变形、提高产品质量具有重要的指导意义。With the Moldflow software, article the warping deformation trend of PCI-E electronic connectors injected by glass fiber reinforced plastic was analyzed, and the reasons for this trend from the product structure were obtained.Immediately, a new structure was proposed to improve the warpage of the current product, while comparing the effects of different glass content and resin substrate on product warpage. After structural improvement and material optimization, the product achieved the desired purpose in warpage. Therefore, the analysis process had important guiding significance for weakening the warpage deformation of such products and improving product quality.

关 键 词：PCI-E连接器 MOLDFLOW 翘曲变形 结构改善 材料优化 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术]