高性能导热胶粘剂热界面材料:机理、现状与趋势  

High-performance thermal interface materials of thermal conductive adhesive:mechanism,status and trend

作　　者：许永伦 庞云嵩 任琳琳 孙蓉[1] 曾小亮[1] Xu Yonglun;Pang Yunsong;Ren Linlin;Sun Rong;Zeng Xiaoliang(Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology Chinese Academy of Sciences,Shenzhen 518100,Guangdong,China)

机构地区：[1]深圳先进电子材料国际创新研究院,中国科学院深圳先进技术研究院,广东深圳518100

出　　处：《中国胶粘剂》2023年第1期44-54,共11页China Adhesives

基　　金：国家自然科学基金项目(62104161、52073300);广东省基础与应用基础研究计划(2020B010190004);中国科学院青年创新促进会项目(2019354);长沙市科技重点项目(kq2102005);广东省重点实验室项目(2014B030301014);深圳市科技研究基金项目(JCYJ20200109114401708)。

摘　　要：本文综述了导热胶粘剂的传热与粘接的基本机理和模型。分析总结了近年来导热胶粘剂的导热增强技术发展情况。着重介绍了环氧导热胶粘剂以及有机硅导热胶粘剂,并探讨了新材料技术对导热胶粘剂的影响。最后对导热胶粘剂现阶段遇到的问题以及未来可能的研究方向进行了展望。In this paper,the basic mechanism and model of heat transfer and bonding of thermal conductive adhesive were reviewed.The development of thermal conductivity enhancement technology of thermal conductive adhesive in recent years was analyzed and summarized.The epoxy thermal conductive adhesive and silicone thermal conductive adhesive were introduced emphatically,and the influence of new material technology on thermal conductive adhesive was discussed.Finally,the problems of thermal conductive adhesive encountered at the present stage and the possible future research directions were prospected.

关 键 词：导热胶粘剂 热界面材料 导热系数 热阻 环氧 有机硅 自修复材料 

分 类 号：TQ437[化学工程]