碳基填料填充型热界面材料的研究现状  

A State-of-the-art Review of Thermal Interface Materials Laded with Carbon Based Filler

作　　者：黄飞 秦文波[1,2] 舒登峰 孙佳晨 王天伦 岳文 Fei Huang;Wenbo Qin;Dengfeng Shu;Jiachen Sun;Tianlun Wang;Wen Yue(College of Engineering and Technology,China University of Geosciences(Beijing),Beijing 100083,China;HYMN Advance Materials Technology(Shenzhen),Shenzhen 518000,China;Zhengzhou Research Institute,China University of Geosciences(Beijing),Zhengzhou 450000,China)

机构地区：[1]中国地质大学(北京)工程技术学院,北京100083 [2]彗晶新材料科技(深圳)有限公司,广东深圳518000 [3]中国地质大学(北京)郑州研究院,河南郑州450000

出　　处：《高分子材料科学与工程》2023年第1期160-167,174,共9页Polymer Materials Science & Engineering

基　　金：国家自然科学基金面上项目(51875537);中央高校基本科研业务费项目(2652018094)。

摘　　要：芯片的集成化和高功率化使其运行过程中热量激增。为了保障设备正常运行,导热性能优异的热界面材料非常关键。对于填充型热界面材料而言,填料的导热性能直接影响整体的导热性能。碳材料动辄上千的导热系数若是可以实现有效应用,对电子行业的发展有着举足轻重的作用。但由于碳基填料几乎都存在难分散、难填充和导热方向性的特点,使得碳基热界面材料的开发和应用存在难点。文中系统介绍了填充型热界面材料的导热机理和碳基填料的影响,重点综述了国内外学者在碳基填料官能化、协同强化、预制碳基骨架和碳基填料定向处理这些有望制备高性能热界面材料的先进技术上的优势和特点,并对这一热门领域未来发展的机遇与挑战进行了展望。The integration and high power of the chips make the heat surge during operation.In order to ensure the normal operation of equipment,thermal interface materials with excellent thermal conductivity are very important.For laden thermal interface materials,the intrinsic thermal conductivity of fillers is crucial to the overall thermal conductivity of composite materials.The thermal conductivity of carbon-based fillers can easily be thousands.If it can be effectively applied,it will play a pivotal role in the development of electronics industry.However,the development and application of carbon-based thermal interface materials are difficult because almost all carbon-based fillers have the characteristics of being difficult to disperse,difficult to fill,and thermal anisotropy.This paper systematically introduced the thermal conductivity mechanism of laden thermal interface materials and the effects of carbon fillers on the thermal conductivity of composites.It focused on the systematic review of the functionalization of carbon-based fillers,synergistic reinforcement between carbon-based fillers,prefabrication of carbon-based frameworks and carbon-based fillers orientation processing by domestic and foreign,which are expected to commercialize high-performance thermal interface materials,and prospected opportunities and challenges for future development in this popular field.

关 键 词：热界面材料 热管理 导热填料 碳基材料 定向处理 

分 类 号：TN40[电子电信—微电子学与固体电子学]