Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices  

作　　者：Vincent Maurice Clément Carlé Shervin Keshavarzi Ravinder Chutani Samuel Queste Ludovic Gauthier-Manuel Jean-Marc Cote Rémy Vicarini Moustafa Abdel Hafiz Rodolphe Boudot Nicolas Passilly 

机构地区：[1]IEMN-Institut d’Electronique de Microélectronique et de Nanotechnologie,UMR8520 CNRS,UniversitéLille,Centrale Lille,F-59000 Lille,France [2]FEMTO-ST Institute,UMR6174 CNRS,UniversitéBourgogne Franche-Comté,F-25030 Besançon,France

出　　处：《Microsystems & Nanoengineering》2022年第6期225-235,共11页微系统与纳米工程（英文）

基　　金：supported partially by the Direction Générale de l’Armement(DGA)and by the Agence Nationale de la Recherche(ANR)in the frame of the ASTRID project named PULSACION under Grant ANR-19-ASTR-0013-01;supported by the EIPHI Graduate school(Grant ANR-17-EURE-0002);the Région Franche-Comté(NOUGECELL project);the EquipX Oscillator-IMP(Grant No.ANR 11-EQPX-0033);supported by the Centre National d’Etudes Spatiales(CNES)and the Agence Innovation Défense(AID).

摘　　要：Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content has to meet high standards of purity and accuracy.Glass-blowing techniques and craftsmanship have evolved over many decades to achieve such standards in macroscopic vapor cells.With the emergence of chip-scale atomic devices,the need for miniaturization and mass fabrication has led to the adoption of microfabrication techniques to make millimeter-scale vapor cells.However,many shortcomings remain and no process has been able to match the quality and versatility of glass-blown cells.Here,we introduce a novel approach to structure,fill and seal microfabricated vapor cells inspired from the century-old approach of glass-blowing,through opening and closing single-use zero-leak microfabricated valves.These valves are actuated exclusively by laser,and operate in the same way as the“make-seals”and“break-seals”found in the filling apparatus of traditional cells.Such structures are employed to fill cesium vapor cells at the wafer-level.The make-seal structure consists of a glass membrane that can be locally heated and deflected to seal a microchannel.The break-seal is obtained by breaching a silicon wall between cavities.This new approach allows adapting processes previously restricted to glass-blown cells.It can also be extended to vacuum microelectronics and vacuum-packaging of micro-electro-mechanical systems(MEMS)devices.

关 键 词：FILLED vacuum HEATED 

分 类 号：TM91[电气工程—电力电子与电力传动]