机载电子模块热设计方案评估  

Design Scheme Evaluation of an Airborne Electronic Module

作　　者：李振东 张卿 郭建平[1] LI Zhen-dong;ZHANG Qing;GUO Jian-ping(AVIC Xi′an Aeronautical Computing Technique Research Institute,Xi′an Shaanxi 710068,China)

机构地区：[1]西安航空计算技术研究所,陕西西安710068

出　　处：《机械研究与应用》2023年第1期170-172,176,共4页Mechanical Research & Application

摘　　要：随着机载电子设备的集成度与复杂度越来越高,其功耗也在不断增加。因此对机载电子设备进行热仿真分析是电子设备结构设计中必不可少的重要一环。该文利用热仿真软件对机载电子模块的不同结构方案进行热仿真分析,通过对比模块稳定工作情况下各元器件的温度得出该模块的最佳设计方案,为后续的电子模块设计积累了经验。With the increasing integration and complexity of airborne electronic equipment, its power consumption is also increasing. Therefore, the thermal simulation analysis of airborne electronic equipment is an essential part in the structural design of electronic equipment. In this paper, the thermal simulation software is used to analyze the different structural schemes of the airborne electronic module, and the best design scheme of the module is obtained by comparing the temperature of each component under the stable operation of the module, which accumulates experience for the subsequent electronic module design.

关 键 词：电子设备 强迫风冷 热仿真 贯通式风冷 

分 类 号：V243[航空宇航科学与技术—飞行器设计]