金属基覆铜板的散热性能研究  

Research on heat dissipation performance of metal base copper clad laminate

作　　者：丘威平 陈毅龙 刘旭亮 黄奕钊 杨单 QIU Weiping;CHEN Yilong;LIU Xuliang;HUANG Yizhao;YANG Dan(Kinwong Electronic Technology(Longchuan)Co.,Ltd.,Heyuan 517373,Guangdong,China;Metal-based Printed Circuit Board Engineering Technology Research and Development Center in Guangdong Province,Heyuan 517373,Guangdong,China)

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517373 [2]广东省金属基印制电路板工程技术研究开发中心,广东河源517373

出　　处：《印制电路信息》2023年第2期1-7,共7页Printed Circuit Information

摘　　要：金属基覆铜板制作的印制电路板具有良好的散热能力,能够大幅降低电子元器件工作温度,提高使用稳定性和长期可靠性,被广泛应用于各种需要散热的场景。基于ASTM-D5470标准《热导性电绝缘材料的热传输特性的标准试验方法》和JESD-51标准《电子器件热测试系列标准》,对金属基覆铜板的散热性能展开研究,测量与分析不同影响因素如铜箔厚度、介质层厚度及铝板厚度的变化对金属基覆铜板散热性能的影响。Metal-based copper clad laminate is a printed circuit board with good heat dissipation ability, which can greatly reduce the operating temperature of electronic components, improve the stability of use and long-term reliability, and is used in various scenarios that require heat dissipation. This article selects the ASTM-D5470 standard and JESD-51 standard to study the heat dissipation performance of metal-based copper clad laminates. The influence of different factors such as the thickness of copper foil, dielectric layer and aluminum plate on the heat dissipation performance of metal clad copper plate is measured and analyzed.

关 键 词：金属基覆铜板 散热性能 印制电路版 导热系数 

分 类 号：TN41[电子电信—微电子学与固体电子学]