厚铜板薄阻焊生产工艺优化  

Optimization on production technology of PCB with thick copper and thin solder mask

作　　者：郝永春 杨勇 李锋 HAO Yongchun;YANG Yong;LI Feng(Victory Giant Technology(Hui Zhou)Co.,Ltd.,Huizhou 516211,Guang Dong,China)

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2023年第2期21-24,共4页Printed Circuit Information

摘　　要：阻焊技术是印制电路板外观和组装品质的主要控制因素技术之一。根据客户要求,面铜铜厚范围为50.8~76.2μm,线路面阻焊层厚度范围为7.62~17.78μm,为此,对阻焊前处理方式、阻焊网版、生产次数、曝光资料、后烤等生产工艺实施优化。优化后的生产工艺解决了厚面铜线路上防焊不露铜的问题,可确保产品达到客户要求标准。Solder mask technology is one of the main control factors that directly affect the appearance and assembly quality of printed circuit boards. After receiving an order from a customer, the company required that the thickness of copper surface should be at least: 50.8~76.2 μm, and the thickness of anti-welding layer on the line surface should be controlled within the limit range: 7.62~17.78 μm. In this paper, based on the optimization of pretreatment, solder mask screen production, solder mask screen plate, production times, exposure data, post-baking and other aspects of optimization, the company realized the solder mask on thick surface of the copper had no fake exposed copper and met the customer requirements.

关 键 词：阻焊前处理 阻焊网版 生产次数 曝光资料 

分 类 号：TN41[电子电信—微电子学与固体电子学]