Dislocation reconfiguration during creep deformation of an Al-Cu-Li alloy via electropulsing  

作　　者：Chang Zhou Lihua Zhan He Li Chunhui Liu Yongqian Xu Bolin Ma Youliang Yang Minghui Huang 

机构地区：[1]College of Mechanical and Electrical Engineering,Central South University,Changsha,410083,China [2]State Key Laboratory of High Performance Complex Manufacturing,Central South University,Changsha,410083,China [3]Light Alloys Research Institute,Central South University,Changsha,410083,China

出　　处：《Journal of Materials Science & Technology》2022年第35期27-34,共8页材料科学技术（英文版）

基　　金：financially supported by the Science and Technology Innovation Program of Hunan Province (No.2020RC4001);the National Natural Science Foundation of China (Nos.51905551,52175373,52005516,);the Free Exploration Project of State Key Laboratory of High-performance Complex Manufacturing (No.ZZYJKT2021-03);the financial support from China Postdoctoral Science Foundation (No.2021M693552)。

摘　　要：Creep mechanism was well-known to be mainly dominated by the dislocation sliding and climbing during creep deformation. Here we study the creep deformation of an Al-Cu-Li alloy with the assistance of electropulsing and subsequent microstructural observations. We find that creep strain increased drastically under electropulsing and was almost twelve times as much as that of the non-pulsed sample. Microstructural observations confirmed that dislocation reconfiguration happens via electropulsing, namely helical dislocations being opened rapidly. This opened dislocation structure can possess a much higher mobility than the initial helical dislocation, which mostly responsible for the greatly increased creep strain. Our results revealed a new mechanism accountable for the distinctly electroplastic creep deformation.

关 键 词：Dislocation reconfiguration Electroplasticity Al-Cu-Li alloy Creep deformation 

分 类 号：TG146.21[一般工业技术—材料科学与工程]