玻璃纤维纸增强PTFE复合基板的制备与性能  

Preparation and Properties of Glass Fiber Paper Reinforced PTFE Composite Substrate

作　　者：庞子博[1] Pang Zibo(The 46 Research Institute of China Elctronics Technology Group Corporation,Tianjin,300220)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《现代塑料加工应用》2023年第1期52-55,共4页Modern Plastics Processing and Applications

摘　　要：以玻璃纤维纸为增强材料,通过浸渍聚四氟乙烯(PTFE)乳液,制得了玻璃纤维纸PTFE浸渍片(记为A)。以A、PTFE薄膜(记为B)和铜箔为原料,制得了一系列复合基板。采用热机械分析仪、万能材料试验机和网络分析仪等研究了复合基板的吸水率、热性能、介电性能和力学性能。结果表明:该复合基板的最优层叠结构为BA2B,最优层压压力为12 MPa,此时,复合基板的介质层厚度为0.254 mm、相对介电常数为2.19、损耗因子为1.0×10^(-3),其综合性能与某进口复合基板相当。The glass fiber paper PTFE impregnated sheet(denoted as A) was prepared by impregnating polytetrafluoroethylene(PTFE) emulsion with glass fiber paper as reinforcement material. A series of composite substrates were prepared using A, PTFE film(denoted as B) and copper foil as raw materials. The water absorption, thermal properties, dielectric properties and mechanical properties of composite substrate were studied by thermomechanical analyzer, universal material tester and network analyzer. The results show that the optimal lamination structure of the composite substrate is BA2B, the optimal lamination pressure is 12 MPa, and the dielectric layer thickness of the composite substrate is 0.254 mm, the relative dielectric constant is 2.19, and the loss factor is 1.0×10^(-3). The comprehensive performance of the composite substrate is comparable to that of an imported composite substrate.

关 键 词：玻璃纤维纸 聚四氟乙烯 复合基板 浸渍 介电性能 

分 类 号：TN04[电子电信—物理电子学] TB332[一般工业技术—材料科学与工程]