自动树脂装载机称重系统设计与应用  

Design and Application of a Weighing System for Automatic Compound Loader

作　　者：班友根 丁丽成 汪宗华 赵松 BAN Yougen;DING Licheng;WANG Zonghua;ZHAO Song(Wenyi Sanjia Tech.Co.,Ltd.,Tongling 244000,China)

机构地区：[1]文一三佳科技股份有限公司,安徽铜陵244000

出　　处：《电子工业专用设备》2023年第1期14-18,24,共6页Equipment for Electronic Products Manufacturing

摘　　要：针对半导体封装工艺需求,设计了一款用于半导体封装过程中塑封材料(树脂)的自动装载设备,实现树脂自动送料、质量检测、剔除废料、真空除尘、自动装载等功能。通过增加称重系统实现对树脂质量的高精度测量,提升半导体封装产品的品质。According to the requirement of semiconductor molding process,an automatic molding material(epoxy molding compound,i.e. EMC) loading equipment during semiconductor molding process is designed to realize the functions of EMC automatic feeding,weight detection,defects discharge,vacuum dust collection,automatic loading and so on. By adding a weighing system to achieve high-precision measurement of EMC quality,and to improve the quality of semiconductor molding products.

关 键 词：树脂 自动装载 半导体封装 称重系统 

分 类 号：TN305[电子电信—物理电子学]