一款高可靠嵌入式处理器芯片的设计  

Design of an embedded processor with high reliability

作　　者：朱英 田增 陈叶 蒋毅飞 李彦哲 刘晓强 ZHU Ying;TIAN Zeng;CHEN Ye;JIANG Yi-fei;LI Yan-zhe;LIU Xiao-qiang(Shanghai High Performance IC Design Center,Shanghai 201204,China)

机构地区：[1]上海高性能集成电路设计中心,上海201204

出　　处：《计算机工程与科学》2023年第3期390-397,共8页Computer Engineering & Science

摘　　要：基于申威自主指令系统设计开发了一款高可靠性、高性能嵌入式处理器芯片。该处理器采用SoC技术和AMBA总线架构,片上集成自主研发的申威第3代64位高性能处理器核心Core3,以及PCIe2.0、USB2.0等多种标准I/O接口,基于国内成熟工艺开发,片上集成2.5亿晶体管,在-55℃~125℃宽温下的核心工作频率达到800 MHz,双精度浮点峰值性能为3.2 GFlops,全片峰值功耗小于3.2 W。详细介绍了该处理器为了实现高可靠性、低功耗和高性能等设计目标,在芯片结构设计、可靠性设计、低功耗设计和物理实现方面所采取的技术方法和手段,并给出了芯片频率、功耗和成品率等主要技术指标的测试结果。该处理器已在多个信息设备领域得到了应用,并取得了较好的社会效益。This paper describes the design of a high-performance embedded processor with high reliability, based on the self-developed Shenwei Instruction Set Architecture(ISA). The processor adopts System-on-Chip(SoC) design technology and AMBA on-chip bus. The third generation of self-developed Shenwei high performance 64-bit CPU core, namely Core3, and multiple standard I/O interface modules including PCIe2.0 and USB2.0 are integrated on the chip. The processor is manufactured using domestic mature process technology, and integrates more than 250 million transistors. The processor can run stably with a core frequency of 800 MHz under a wide environment temperature range(-55℃~125°C). The peak performance of double-precision floating-point number is up to 3.2 GFlops and the maximum power consumption is less than 3.2 W. In order to achieve the design goals of high reliability, low power consumption and high performance, the technical methods and means of the chip structure design, reliability design, low power design and physical implementation are introduced in detail, and the test results of the main technical indexes such as chip frequency, power consumption and yield are given. The processor has been applied in many information devices and has achieved good social benefits.

关 键 词：片上系统 嵌入式处理器 低功耗设计 AMBA总线 申威 

分 类 号：TP302[自动化与计算机技术—计算机系统结构]