Sn-Bi基低温无铅焊料的研究进展  

Research progress of Sn-Bi based low temperature lead-free solder

作　　者：申兵伟 徐明玥 杨尚荣 刘国化 谢明[1] SHEN Bingwei;XU Mingyue;YANG Shangrong;LIU Guohua;XIE Ming(Kunming Insitute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.,Ltd.,Kunming 650106,China)

机构地区：[1]昆明贵金属研究所贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,云南昆明650106

出　　处：《电子元件与材料》2023年第2期144-152,共9页Electronic Components And Materials

基　　金：科技部“科技助力经济2020”重点专项(SQ2020YFF0426390);云南省重大科技专项资助项目(202002AB080001-1,202002AB080001-6);2019云南省稀贵金属材料基因工程项目(2019ZE001-2);云南省科技人才与平台计划资助项目(202105AE160027)。

摘　　要：作为一种新型低温无铅焊料,Sn-Bi基低温无铅焊料具有较低的熔化温度以及优良的焊接性能,在电子封装领域有着广泛的应用。随着电子元器件向微型化方向的发展,对低温无铅焊料的性能提出了更高的要求。添加微量的合金元素及纳米颗粒可以改善焊料的组织性能,满足电子元器件发展的需求。系统介绍了Sn-Bi基低温无铅焊料的组成、结构以及焊接性能,综述了合金元素和纳米颗粒对Sn-Bi基低温无铅焊料组织性能的影响及作用机理,分析了在研制Sn-Bi基低温无铅焊料过程中存在的不足之处,并提出了相应的改进方法。最后对Sn-Bi基低温无铅焊料在发展中需要关注的问题进行了总结与展望。Sn-Bi based solder,as a new low temperature lead-free solder,has been widely used in electronic packaging due to its low melting temperature and excellent welding performance.As electronic components develop towards miniaturization,higher demands are put forward for the performance of low-temperature lead-free solders.Addition of trace alloying elements and nanoparticles can improve the microstructure and properties of solders to meet the needs of the development of electronic components.The composition,structure and soldering performance are systematically reviewed for Sn-Bi-based low temperature lead-free solder.The mechanism are analyzed on how alloying elements and nanoparticles affect the microstructure and properties of Sn-Bi-based low temperature lead-free solder.The shortcomings are analyzed for the process of developing Sn-Bi-based low temperature lead-free solder,and possible solution are put forward.Finally,additional key issues are summarized and prospected for the development of Sn-Bi-based low-temperature lead-free solders.

关 键 词：Sn-Bi基低温无铅焊料 组织性能 综述 合金元素 纳米颗粒 

分 类 号：TG425[金属学及工艺—焊接]