微凸点阵列等效热导率模型及仿真验证  

Extraction and Verification of Thermal Simulation Equivalent Model of Micro-Bump Array

作　　者：刘云婷 苏梅英 李君[1,2] 曹立强 LIU Yun-ting;SU mei-ying;LI Jun;CAO Li-qiang(Research and Development Department,National Center for Advanced Packaging Co.,Ltd.,Wuxi Jiangsu 214135,China;Institute of Microelectronics,Chinese Academy of Science,Beijing 100029,China)

机构地区：[1]华进半导体封装先导技术研发中心有限公司基础研发部,江苏无锡214135 [2]中国科学院微电子研究所,北京100029

出　　处：《计算机仿真》2023年第2期326-330,373,共6页Computer Simulation

摘　　要：提出了一种基于高密度微凸点阵列的等效建模方法,以提高目前先进封装散热仿真的求解精度。基于傅里导热定律,研究阵列模型中热量传导路径,结合三维几何积分计算,求解出各向异性材料模型纵向、横向热导率的准确表达式,仿真验证最高温度偏差不超过1.659%的同时,降低80%以上的计算资源。通过上述方法,将一种扇出型晶圆级封装结构中的微凸点阵列进行等效替换,网格数降低83.15%,计算时间降低72.98%,关键测试点温度偏差在1.80%以内。等效模型可以在保证高水平的计算精度的同时,降低计算成本,在高集成度的先进封装热管理工作中具有较大实用性。An equivalent thermal model is proposed to estimate the heat transfer of advanced packaging structures with micro-bump arrays at a lower computational cost in this paper.First,the equivalent thermal conductivity was demonstrated both in the vertical direction and the lateral direction.And a primary three-dimensional model with micro-bump array was characterized by varying column diameters to verify the efficiency and the accuracy of the equivalent model.The value of the maximum temperature deviation between the detailed model and the equivalent model is 1.659%,with more than 80%computation consumption saved in the equivalent thermal model.Furthermore,modeling and thermal analysis of a FOWLP structure were presented in this paper.Based on the proposed method,the equivalent thermal model of the packaging structure was proposed.The relative error of the prediction value of junction temperature is around 1.80%.Moreover,the computational time of the equivalent model of the FOWLP structure is reduced by 72.98%.The equivalent thermal model of a cylindrical micro-bump array proposed in this paper can simplify the simulation process by building a rectangular model,and the anisotropic thermal conductivity of it is with high accuracy if the geometrical parameters and material properties are given.The above method has great practicality in the thermal management of advanced packaging.

关 键 词：微凸点 热管理 热导率 等效模型 

分 类 号：N945.12[自然科学总论—系统科学]