Numerical simulation and printability analysis of fused deposition modeling with dual-temperature control  被引量:3

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作  者:Xiaodan Huo Bin Zhang Qianglong Han Yong Huang Jun Yin 

机构地区:[1]The State Key Laboratory of Fluid Power and Mechatronic Systems,School of Mechanical Engineering,Zhejiang University,Hangzhou 310028,China [2]Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province,School of Mechanical Engineering,Zhejiang University,Hangzhou 310028,China [3]Department of Mechanical and Aerospace Engineering,University of Florida,Gainesville,FL 32611,USA

出  处:《Bio-Design and Manufacturing》2023年第2期174-188,共15页生物设计与制造(英文)

基  金:The authors gratefully acknowledge the support provided by the National Natural Science Foundation of China(Nos.52250006 and 52075482);the Starry Night Science Fund of Zhejiang University Shanghai Institute for Advanced Study(No.SNZJU-SIAS-004).

摘  要:Ideal tissue engineering scaffolds need interconnected pores and high porosity to enable cell survival,migration,proliferation,and differentiation.However,obtaining a high-resolution structure is difficult with traditional one-temperature control fused deposition modeling(FDM).In this study,we propose a dual-temperature control method to improve printability.A numerical model is developed in which the viscosity is a function of temperature and shear rate to study the influence of two different temperature control modes.Quantitative tests are used to assess filament formation and shape fidelity,including one-dimensional filament printing,deposition at corners,fusion,and collapse.By using dual-temperature control,the width of the deposited poly(ε-caprolactone)filament is reduced to 50μm.The comparative results of both the experimental method and numerical simulation suggest that the dual-temperature control FDM can manufacture spatially arranged constructs and presents a promising application in tissue engineering。

关 键 词:Fused deposition modeling(FDM) Dual-temperature control Filament deposition Printing resolution VISCOSITY 

分 类 号:TP334.8[自动化与计算机技术—计算机系统结构]

 

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