灌胶对LED电源的EMI特性影响研究  

Research on EMI Characteristics of LED Power Supply with Glue

作　　者：李欢欢 董纪清[1] 毛行奎[1] LI Huanhuan;DONG Jiqing;MAO Xingkui(College of Electrical Engineering and Automation,Fuzhou University,Fuzhou 350108)

机构地区：[1]福州大学电气工程与自动化学院,福州350108

出　　处：《磁性元件与电源》2023年第3期142-147,155,共7页Components and Power

摘　　要：LED电源灌胶可以提高电源散热性能,起到防水密封、保护电源元件,提高电子元器件的使用寿命和稳定性等作用。但由于灌胶材料的介电常数要比空气大,导致灌胶后电源的EMI噪声会恶化。本文针对LED电源灌胶后的EMI特性展开研究。在分析主电路电场耦合的基础上,利用电磁场仿真软件同时结合二端口网络理论提取主电路灌胶前后的电场耦合参数,建立差模干扰和共模干扰下的电场耦合模型,并深入分析了灌胶后耦合参数的变化对电磁干扰的影响,为工程应用中电源灌胶对电磁干扰的影响提供了理论分析依据。LED power supply glue can improve the heat dissipation performance of power supply,and also play the role of waterproof and sealing,protecting power components,improving the service life and stability of electronic components.However,the dielectric constant of the sealant is larger than that of air,which leads to the deterioration of EMI noise of the power supply after glue filling.In this paper,the EMI characteristics of LED power supply after gluing are studied.Based on the analysis of the electric field coupling of the main circuit,the electric field coupling parameters of the main circuit before and after glue pouring are extracted by using the electromagnetic simulation software combined with the two port network theory,and the electric field coupling models under differential mode interference and common mode interference are established.The influence of the coupling parameters after gluing on electromagnetic interference is deeply analyzed,which provides theoretical analysis basis for the influence of power supply gluing on electromagnetic interference in engineering application.

关 键 词：LED电源 灌胶 电场耦合 电磁干扰 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]