Ag含量对Sn-20Bi-0.7Cu焊料中金属间化合物形成与生长的影响  

Effect of Ag Content on Formation and Growth of Intermetallic Compounds in Sn-20Bi-0.7Cu Solder

作　　者：陈东东[1] 秦俊虎 甘有为 张欣 白海龙 赵玲彦 易健宏[1] 严继康[1,4] Chen Dongdong;Qin Junhu;Gan Youwei;Zhang Xin;Bai Hailong;Zhao Lingyan;Yi Jianhong;Yan Jikang(Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Tin Products Manufacturing Co.,Ltd of YTCL,Kunming 650217,China;R&D Center,Yunnan Tin Group(Holding)Co.,Ltd,Kunming 650000,China;School of Engineering,Southwest Petroleum University,Nanchong 637001,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业锡材有限公司,云南昆明650217 [3]云南锡业集团(控股)有限责任公司研发中心,云南昆明650000 [4]西南石油大学工程学院,四川南充637001

出　　处：《稀有金属材料与工程》2023年第2期502-507,共6页Rare Metal Materials and Engineering

基　　金：Major Science and Technology Project in Yunnan Province-New Material Special Project(202105AE160028);Yunnan Province Transformation Research Institute Technology Development Research Project-Innovation Guidance and Technology Enterprise Cultivation Plan(202202AB080001);Fundamental Research and Applied Basic Research Enterprise Joint Project Between Yunnan Provincial Department of Science and Technology and Yunnan Tin Group(Holding)Company Limited(202101BC070001-010)。

摘　　要：研究了Sn-20Bi-0.7Cu-xAg焊料凝固和时效过程中的物相生长动力学。通过实验和数值分析相结合分析了Ag含量和时效条件对界面结构和生长的影响,实验中对Sn-20Bi-0.7Cu分别添加了质量分数0.1%、0.4%、0.7%、1.0%、1.5%的Ag。为验证焊接接头的服役可靠性,在85℃和85%的湿度条件下,将接头放置0、10、30、50、100、200和500 h。采用扫描电镜等设备分析时效过程中界面化合物的形貌、厚度和分布,分析了β-Sn的形核界面和取向。结果表明,焊料中Ag含量的增加可以抑制界面Cu_(6)Sn_(5)层的生长,等温时效期间金属间化合物(Cu_(6)Sn_(5)+Cu_(3)Sn)的生长为扩散控制机制。焊接时形成的扇贝状表面在时效时消失,这表明在垂直于界面方向上的生长机制变为稳定性增长,说明Ag3Sn有效降低了Cu_(6)Sn_(5)的生长动力。The interfacial reactions and growth kinetics of Sn-20Bi-0.7Cu-xAg(x=0.1, 0.4, 0.7, 1.0, 1.5, wt%) were investigated during solid-state aging. The effects of chemical composition on the structure and the growth of interface under high temperature and high humidity conditions were studied experimentally and numerically. In order to determine the long-term reliability of the solder joints, thermal accelerated aging tests were performed for 0, 10, 30, 50, 100, 200 and 500 h under 85 ℃ and 85% relative humidity conditions. The surface morphology, thickness, and distribution of interface compounds were observed by scanning electron microscope. The nucleation surface and growth direction of β-Sn were clarified. The phases were determined at the interface and the alloy matrix. Results show that with increasing the Ag content, the growth of the Cu_(6)Sn_(5)layer is suppressed. The growth kinetics of intermetallic compound(Cu_(6)Sn_(5)+Cu_(3)Sn) remains a diffusion-controlled process during the isothermal aging. The scallop-type Cu_(6)Sn_(5)phase disappears at later aging stages, suggesting that the growth mechanism changes to the steady growth in the direction perpendicular to the interface. Besides, the results reveal that Ag3Sn effectively slows down the growth kinetics of Cu_(6)Sn_(5).

关 键 词：Sn-20Bi-0.7Cu 金属间化合物 凝固 界面结构 生长动力学 

分 类 号：TG42[金属学及工艺—焊接]