TC11钛合金扩散连接接头组织及力学性能研究  

Microstructure and Mechanical Properties of Diffusion Bonded TC11 Alloy Joint

作　　者：高云鹏 王颖[1] 王东坡[1] 杨振文[1] Gao Yunpeng;Wang Ying;Wang Dongpo;Yang Zhenwen(Tianjin Key Laboratory of Advanced Joining Technology,Tianjin University,Tianjin 300350,China)

机构地区：[1]天津大学天津市现代连接重点实验室,天津300350

出　　处：《稀有金属材料与工程》2023年第2期770-776,共7页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51774214)。

摘　　要：研究不同连接温度对TC11合金直接扩散连接接头的显微组织和力学性能的影响,并与原始母材进行了比较。结果表明:TC11合金直接扩散连接的最优工艺参数为900℃, 20 MPa, 60 min,扩散接头界面处无孔洞,接头抗拉强度与原始TC11母材接近且塑性优于原始母材。对原始TC11母材和最优工艺参数下的扩散焊接头在室温下进行高周疲劳性能测试,与原始TC11母材相比,TC11合金直接扩散连接接头的疲劳性能降低,且所有接头断裂均发生在扩散结合界面处。通过观察疲劳断口结合界面的微观结构特征分析得出,扩散接头界面两侧母材的晶体取向差异使得疲劳裂纹萌生,这是接头疲劳性能降低的主要原因。The effects of different bonding temperatures on the microstructure and mechanical properties of TC11 alloy diffusion bonded joints were investigated and compared with the original base metal. The experimental results show that the optimal parameters for direct diffusion bonding of TC11 alloy are 900 ℃, 30 min, 60 min. There are no holes at the interface of the diffusion bonded joint, and the tensile strength of the joint is close to that of the original TC11 alloy base metal. In addition, the plasticity of TC11 alloy diffusion bonded joint is better than that of the original base metal. High cycle fatigue properties tests were performed at room temperature for the original TC11 alloy base metal and the diffusion bonded joints under optimal process parameters. Compared with the original TC11 alloy base metal, the fatigue property of the direct diffusion bonded TC11 alloy joint is reduced, and all the diffusion bonded joint fractures occur at the diffusion bonded interface. By observing the microstructural characteristics of the fatigue fracture and interface, it is concluded that the difference in the crystal orientation of the base metal on both sides of the interface of the diffusion joint causes fatigue crack initiation,which is the main reason for the reducing of the fatigue property of the diffusion bonded joint.

关 键 词：TC11合金 扩散连接 显微组织 疲劳性能 

分 类 号：TG454[金属学及工艺—焊接]