等离子体溅射对微型钻头表面ta-C涂层结合特性及摩擦性能的影响  

Effect of Plasma Sputtering on Adhesion Characteristics and Friction Properties of ta-C Coatings on Micro Drills

作　　者：罗春峰 胡健 陈成 屈建国 Luo Chunfeng;Hu Jian;Chen Cheng;Qu Jianguo(Shenzhen Jinzhou Precision Technology Co.,Ltd.,Shenzhen Guangdong 518000,China)

机构地区：[1]深圳市金洲精工科技股份有限公司,广东深圳518000

出　　处：《硬质合金》2023年第1期16-25,共10页Cemented Carbides

摘　　要：无氢类金刚石涂层(ta-C)常用于提高刀具表面润滑性,提升极细微型钻头的排屑性能,降低断刀率。但ta-C涂层内应力大,与硬质合金钻头间的结合力较差,等离子溅射是提升涂层与基体之间结合力的有效方法。本文利用离子源产生的氩离子对硬质合金微型钻头和样块表面进行等离子体溅射,研究基体电流密度对基体表面形貌的影响;再利用阴极弧技术在等离子体溅射后的硬质合金表面制备ta-C涂层,研究不同溅射基体电流密度对ta-C涂层结合特性的影响。利用球盘式摩擦磨损试验机对溅射后的硬质合金表面以及ta-C涂层摩擦系数进行测试。通过钻孔测试,研究钻孔过程中基体电流密度对涂层与基体结合特性以及涂层微型钻头断刀率的影响。结果表明,随着溅射基体电流密度的增加,基体表面钴含量逐渐减少。压痕测试结果显示,合理的溅射基体电流密度(19.1 mA/cm^(2))下,可得到高结合力等级(HF1)。高结合力等级的ta-C涂层,摩擦系数最低为0.096。涂层钻头加工通信印制电路板1000孔后,高结合力ta-C涂层钻头的槽内涂层无异常脱落,测试1000支后无断刀。Hydrogen-free diamond-like carbon coatings(ta-C) are often used to improve the lubricity of tools and chip removal performance of ultra-small micro drills to decrease the fracture ratio. The internal stress of ta-C coatings, however,is large, which leads to poor adhesion with cemented carbide drills. Plasma sputtering is an effective method to improve the adhesion between coatings and substrates. In this study, the argon ion produced by the ion source was used for plasma sputtering on the micro drills of cemented carbides and sample blocks, and the influence of the current density of the substrate on its surface morphology was investigated. ta-C coatings were prepared on the surface of cemented carbides after plasma sputtering by cathode arc technology, and the effect of different current densities of sputtered substrates on the adhesion characteristics of ta-C coatings was studied. In addition, the friction coefficients of sputtered cemented carbide surface and ta-C coatings were tested by a ball-on-disk friction and wear tester. The drilling test was then conducted to study the adhesion between coating and substrate during drilling and the influence of adhesion on the fracture ratio.According to the result, the content of cobalt on the substrate declines as the current density of the sputtered substrate increases. The indentation test shows that an appropriate current density(19.1 mA/cm^(2)) of the sputtered substrate can lead to high adhesion level(HF1). The lowest friction coefficient of ta-C coatings with high adhesion is 0.096. After drilling 1000 holes in the printed circuit board for communication, the drill with high-adhesion ta-C coatings sees no abnormal shedding of the coatings in the flute, and micro drills do not break after processing 1000 pieces.

关 键 词：等离子体溅射 ta-C涂层 结合特性 摩擦性能 微型钻头 

分 类 号：TG174.4[金属学及工艺—金属表面处理]