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作 者:宿浩 李雪 赵庆桢 陈姬 武传松[1] SU Hao;LI Xue;ZHAO Qingzhen;CHEN Ji;WU Chuansong(MOE Key Lab for Liquid-Solid Structure Evolution and Materials Processing and Institute of Materials Joining,Shandong University,Ji'nan 250061,China)
机构地区:[1]山东大学材料科学与工程学院、材料液固结构演变与加工教育部重点实验室,山东济南250061
出 处:《电焊机》2023年第3期91-100,共10页Electric Welding Machine
基 金:国家自然科学基金青年科学基金项目(52005297)。
摘 要:采用搅拌摩擦焊接技术对2 mm厚6061铝合金和紫铜合金异质金属进行对接试验,研究搅拌针偏移量对铝/铜异质金属接头组织和性能的影响。研究发现,由于铝和铜两种材料的流动性存在差异,随着搅拌针由铝侧向铜侧偏移,搅拌头-工件界面的温度无明显变化,而焊接过程中的前进阻力显著增大,且接头机械互锁程度也更加充分。对铝/铜异质接头微观形貌进行扫描电子显微镜分析,发现铝/铜界面处的金属间化合物层呈清晰的双层结构,分别为靠近铝侧的Al_(2)Cu层和靠近铜侧的Al_(4)Cu_(9)层,此外金属间化合物还以颗粒状和条带状等形貌分布在铝/铜界面附近。搅拌针偏向铜侧0.5 mm时得到的铝/铜异质接头机械互锁程度和金属间化合物分布最为理想,接头抗拉强度达到200 MPa。Dissimilar alloys of 6061 aluminum and T2 copper with thickness of 2 mm were butt joined by utilizing friction stir welding(FSW)to investigate the effect of pin offset values on microstructure and mechanical property of the Al/Cu joints.It was found that the temperature at the tool-workpiece interface was kept relatively stable,but the transverse force was increased gradually,and the material interlocking of dissimilar Al/Cu was also enhanced with the pin offsetting from Al side to Cu side,which was because of the dissimilar material flow characteristics between Al and Cu.The Scanning Electron Microscopy(SEM)analysis were performed on the microstructure of dissimilar Al/Cu FSW joints,it was demonstrated that the Intermetallic Compounds(IMCs)at the Al/Cu joining interface were distinct two-layers structure,which was Al_(2)Cu layer at Al side and the Al_(4)Cu_(9) layer at Cu side,and the IMCs were also distributed with various structures with both granular and banded shapes near the Al/Cu interface.The optimal material interlocking and IMCs distribution of Al/Cu FSW joint were achieved with pin offsetting 0.5 mm to Cu side,and the maximum Al/Cu joint tensile strength was 200 MPa.
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