轻质高导热碳质材料研究进展  

Research Progress of High Thermal Conductivity Carbon Materials

作　　者：殷忠义 YIN Zhongyi(The 38th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230088

出　　处：《电子工艺技术》2023年第2期47-50,54,共5页Electronics Process Technology

基　　金：科技基础加强计划技术领域基金项目。

摘　　要：近年来,以高导热石墨(烯)材料为代表的高导热碳材料在电子设备热管理领域的应用成为研究热点,高导热的碳材料具有低密度、低热膨胀系数、高热导率、高强度、优异的耐高温性能以及抗化学腐蚀性等诸多优点,是高导热材料的主要研究方向之一。主要阐述了高导热碳材料的特点、研究进展。High thermal conductivity carbon materials,represented by high thermal conductivity grapheme,have become one of the research hotspots of thermal management materials in recent years.High thermal conductivity carbon materials,which are ones of the main research directions of high thermal conductivity materials,have many advantages such as low density,low thermal expansion coefficient,high thermal conductivity,high strength,excellent high temperature resistance and chemical corrosion resistance.The characteristics and progress of high thermal conductivity carbon materials are mainly described.

关 键 词：高导热 碳材料 电子设备 石墨烯 热管理 

分 类 号：TN604[电子电信—电路与系统]