高导热系数纳米银胶可靠性研究及应用  

Research and application of reliability of high thermal conductivity nano-silver adhesive

作　　者：冉崇胜 王艳 RAN Chongsheng;WANG Yan(Shenzhen Aoniu Technology Co.,Ltd.,Shenzhen 515100,Guangdong,China)

机构地区：[1]深圳市傲牛科技有限公司,广东深圳515100

出　　处：《应用技术学报》2023年第1期48-51,共4页Journal of Technology

摘　　要：高导热系数的纳米银胶的可靠性研究及其应用引起了广泛的关注。回顾了近年来对纳米银胶的研究,并介绍了纳米银的制备、纳米银胶的可靠性研究及其应用。总结了有关纳米银胶存在的不足和未来的发展方向,希望为高导热系数纳米银胶的实际应用提供一些理论参考。The reliability study and application of nano-silver adhesives with high thermal conductivity have attracted widespread attention.The recent research on nano-silver adhesive was reviewed,and its preparation,reliability and application were introduced.In addition,the research limitations and future development direction of nano-silver adhesive were summarized,so as to provide some theoretical references for the practical application of nano-silver adhesive with high thermal conductivity.

关 键 词：导热系数 可靠性 焊料合金 纳米银胶 

分 类 号：TN304.0[电子电信—物理电子学]