固结硅基聚集体金刚石磨料垫的研磨性能  

Lapping performance of fixed silicon-based agglomerated diamond abrasive pad

作　　者：盛鑫 朱永伟 任闯 任泽 董彦辉 SHENG Xin;ZHU Yongwei;REN Chuang;REN Ze;DONG Yanhui(Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机电学院江苏省精密与微细制造技术重点实验室,江苏南京210016

出　　处：《光学精密工程》2023年第6期839-848,共10页Optics and Precision Engineering

基　　金：国家自然科学基金联合基金资助项目(No.U20A20293)。

摘　　要：磨粒的微破碎是影响固结磨料垫研磨性能的主要因素,结合剂的组成与强度影响其微破碎行为。为实现高效研磨加工,探索不同组份的硅基结合剂聚集体磨粒的制备工艺及其研磨加工性能。在840℃,880℃,920℃温度下采用硅含量不同的结合剂制备聚集体金刚石磨粒,观察其微观形貌,并用其制备固结磨料垫,比较其在7 kPa,14 kPa,21 kPa研磨压力下固结硅基聚集体磨料垫研磨K9玻璃的研磨性能。结合剂中硅含量越高、烧结温度越高,结合剂填充越均匀、孔隙分布越合理,聚集体磨粒研磨加工时微破碎越明显,加工性能随之提升;在21 kPa研磨压力下,结合剂中硅含量最高、烧结温度为920℃制得的硅基聚集体金刚石磨料所制成的亲水性固结磨料垫研磨K9玻璃效率最高,材料去除率达到63.32μm/min,表面粗糙度Ra值为0.515μm。采用固结硅基聚集体金刚石磨料垫可以实现K9光学玻璃的高效研磨。Typically,abrasive microfracture is a predominant factor affecting fixed abrasive(FA)pad per⁃formance.Moreover,the compositions and bonding strengths of the binder determine its microfracture be⁃havior.To realize a highly efficient lapping process,the preparation of silicon-based agglomerated dia⁃mond(SAD)abrasives and the effect of the binder composition on lapping performance were investigated.SAD abrasives with various silicon content binders were prepared at 840℃,880℃,and 920℃,and their micromorphologies were observed using a scanning electron microscope.Lapping tests were conducted on a K9 specimen,and the lapping performance of the aforementioned FA pads at loads of 7,14,and 21 kPa was compared.The higher the sintering temperature and silicon content of the binder,the more uniform the binder filling,the more reasonable the pore distribution,and the more evident the microbreakage dur⁃ing the SAD grinding process.Under the 21 kPa load,the material removal rate(MRR)of the FA pad with SAD abrasives possessing the highest silicon content and sintered at 920℃was the highest reaching 63.32μm/min,while the Ra was approximately 0.515μm.Under the 7 kPa lapping load,the average surface roughness of a workpiece lapped by an FA pad with SAD abrasives possessing the lowest silicon content and sintered at 920℃was the lowest reaching approximately 0.182μm,while the MRR was 7.89μm/min.Efficient lapping of K9 optical glass can be achieved using a consolidated SAD abrasive pad.

关 键 词：高效研磨 固结磨料垫 聚集体金刚石 硅基结合剂 

分 类 号：O786[理学—晶体学]