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作 者:赵文 杨朝阳[1] 阴亚东[2] 周常恩[1] 赖新梅[1] 李灿东[1] ZHAO Wen;YANG Zhao-yang;YIN Ya-dong;ZHOU Chang-en;LAI Xin-mei;LI Can-dong(Fujian University of Traditional Chinese Medicine,Fuzhou 350122,China;Fuzhou University,Fuzhou 350116,China)
机构地区:[1]福建中医药大学,福建福州350122 [2]福州大学,福建福州350116
出 处:《时珍国医国药》2023年第1期227-230,共4页Lishizhen Medicine and Materia Medica Research
基 金:福建省高校产学合作项目(2020Y4017);福建中医药大学财政补助专项(X2020001-财政专项);载人航天领域预先研究项目(020104);福建中医药大学校管课题(X2021018)。
摘 要:随着社会对中医诊疗设备智能化、便携化和产业化的要求不断提高,中医诊疗芯片研发逐渐成为现代中医诊疗装备研究中的前沿内容,在加快中医药现代化进程中发挥了关键作用。然而,一款芯片的研发并非易事,其中,数据要素模块是中医诊疗芯片研发的基点,主要包含中医规范化诊疗数据库的构建和中医现代化诊疗仪器设备的辅助采集两大方面内容。指令要素模块是中医诊疗芯片研发的支点,主要包含中医思维模型的构建和智能算法模型的构建两大方面内容。载体要素模块是中医诊疗芯片研发的落点,主要包含芯片封装技术的赋能和新型材料与技术的助力两大方面内容。本文结合中医诊疗原理与芯片制作原理从芯之基础、芯之内核以及芯之载体三个方面阐述中医诊疗芯片的研发路径。With the increasing social requirements for the intellectualization,portability and industrialization of TCM diagnosis and treatment equipment,CHIP development of TCM diagnosis and treatment has gradually become the forward content of modern TCM diagnosis and treatment equipment research,and has played a key role in accelerating the modernization of TCM.However,developing a chip is not easy.Among them,the data element module is the base point of TCM diagnosis and treatment chip re-search and development,mainly including the construction of standardized TCM diagnosis and treatment database and the auxiliary collection of modern TCM diagnosis and treatment equipment.The instruction element module is the fulcrum of TCM diagnosis and treatment chip research and development,which mainly includes the construction of TCM thinking model and the construction of intelligent algorithm model.Carrier element module is the landing point of TCM diagnosis and treatment chip research and devel-opment,which mainly includes two aspects:enabling chip packaging technology and assisting new materials and technologies.Based on the principle of TCM diagnosis and treatment and the principle of chip making,this paper expounds the development path of TCM diagnosis and treatment chip from three aspects:core foundation,core core and core carrier.
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