硫代酰胺螯合树脂的吸附特性与电镀废水银回收  

Adsorption Characteristics of Thioamide Chelating Resin and Its Silver Recovery from Electroplating Wastewater

作　　者：王铭剑 王康杰 刘耀驰[1] WANG Ming-jian;WANG Kang-jie;LIU Yao-chi(School of Chemistry and Chemical Engineering,Central South University,Changsha 410083,China;SMIC International Integrated Circuit Manufacturing Co.,Ltd.,Beijing 100176,China)

机构地区：[1]中南大学化学化工学院,湖南长沙410083 [2]中芯国际集成电路制造有限公司,北京100176

出　　处：《精细化工中间体》2023年第1期60-66,共7页Fine Chemical Intermediates

基　　金：湖南省重点领域研发计划(2019KW2031)。

摘　　要：电镀废水银吸附回收受共存离子及有机物影响。基于胺基聚苯乙烯(APS)制备了一种胺基和芳环协同的硫代酰胺螯合树脂ATMCR,在银吸附特性研究的基础上,将其应用于电镀废水银回收。采用FT-IR、SEM和BET对合成树脂进行了表征。ATMCR对Ag(I)的吸附属于自发、吸热过程,符合拟二级动力学模型,吸附pH为1~2,318 K时ATMCR的吸附容量达177.6 mg/g。高、低两种浓度电镀废水的处理实践表明,在Cu、Ni和COD共存时,ATMCR的Ag回收率>98%,具备较好的工业应用前景。The adsorption and recovery of silver from electroplating wastewater are affected by coexisting ions and organic materials.A thioamide chelating resin ATMCR based on amine polystyrene(APS)was prepared.Based on its silver adsorption characteristics,ATMCR was applied in the recovery of silver from electroplating wastewater.The synthesized resin was characterized using FT-IR,SEM and BET.The adsorption of Ag(I)by ATMCR was a spontaneous and endothermic process,and conformed to the pseudo-second-order kinetic model.Its adsorption capacity reached 177.6 mg/g at 318 K,and the optimal pH range was between 1 and 2.ATMCR was applied to treat electroplating wastewater with high and low concentration.Its recovery rates of Ag were higher than 98%under the coexistence of Cu,Ni and COD.This material has shown a good industrial application prospect.

关 键 词：硫代酰胺螯合树脂 银 吸附特性 电镀废水 

分 类 号：TQ424[化学工程]