PCB电路板及其电子元器件系统级散热技术进展  

Development of system level heat dissipation technology for PCB and its electronic components

作　　者：罗立晟 刘益才[1,2] 廖子淼 钟杰 Luo Lisheng;Liu Yicai;Liao Zimiao;Zhong Jie(School of Energy Science and Engineering,Central South University,Changsha 410083,China;Hunan Province Engineering Technology Research Center of New Type of Multifunctional Building Materials for Energy Storage and Sound Absorption,Shaoyang 420021,China)

机构地区：[1]中南大学能源科学与工程学院,长沙410083 [2]湖南省新型储能吸音多功能建材工程技术研究中心,邵阳420021

出　　处：《低温与超导》2023年第2期48-54,共7页Cryogenics and Superconductivity

基　　金：国家自然科学基金(51776226)资助。

摘　　要：针对电子设备的热失效问题,介绍了PCB电路板及其电子元器件的散热方式和特点,将系统级散热技术分为单相散热和多相散热,指出各种散热技术的热流密度范围,从散热结构、运行参数、材料与工质、散热技术耦合等角度论述了各种散热技术的研究进展。提出了散热器设计、纳米颗粒应用、散热技术耦合、精密控制技术、PCB设计、减振与降噪几个发展重点,为PCB电路板及其电子元器件系统级散热技术进一步发展提供了建议。In view of the thermal failure of electronic devices, the heat dissipation methods and characteristics of PCB circuit boards and their electronic components were introduced, the system-level heat dissipation technologies were divided into single-phase heat dissipation and multi-phase heat dissipation, the heat flow density range of various heat dissipation technologies was pointed out, and the research progress of various heat dissipation technologies was discussed from the perspectives of heat dissipation structure, operation parameters, materials and work materials, and heat dissipation technology coupling. Several development priorities were proposed for heat sink design, nanoparticle application, heat dissipation technology coupling, precision control technology, PCB design, vibration and noise reduction, which could provide suggestions for the further development of system-level heat dissipation technology for PCB circuit boards and their electronic components.

关 键 词：电子元器件 系统级 散热 相变 高热流密度 

分 类 号：TK124[动力工程及工程热物理—工程热物理]