微厚胶层恒温固化状态动态监测系统设计及优化  

Design and Optimization of Dynamic Monitoring System for Curing State of Micro Thick Adhesive Layer at Constant Temperature

作　　者：郑祥柯[1] 李华[1] 康世发[1] 秦星[1] 陈彦龙 舒林森[2] ZHENG Xiang-ke;LI Hua;KANG Shi-fa;QIN Xing;CHEN Yan-long;SHU Lin-sen(Xi’an Institute of Optics and Precision Mechanics,CAS,Xi’an 723001,China;School of Mechanical Engineering,Shaanxi University of technology,Hanzhong 723001,China)

机构地区：[1]中国科学院西安光学精密机械研究所,陕西西安710119 [2]陕西理工大学机械工程学院,陕西汉中723001

出　　处：《光学与光电技术》2023年第1期37-45,共9页Optics & Optoelectronic Technology

基　　金：国家自然科学基金(52075544);国防科技重点实验室基金(JCKY61420052022)资助项目。

摘　　要：为了解决恒温条件下光学部件粘接用微厚胶层凝固应力无法定量获知的难题,设计了一种微厚胶层恒温固化状态动态监测系统。首先通过微厚胶层恒温凝固应力产生机理及影响因素分析,确定了微厚胶层恒温固化状态动态监测系统的工作原理,制定了胶层固化状态监测系统的总体方案;然后设计了各功能模块的关键部件结构,对其支撑结构的刚度、挠度和形变进行详细计算与有限元分析,并建立基于装配方向图的整机装配模型;最后对所设计系统的性能进行实验验证。结果表明:经过优化后的监测系统设计合理,带45°支撑角的U型结构整体刚度较初选7型结构提高了84%,使用该系统监测并获得了两种胶层固化阶段的状态特征和应力方向及数值,应用效果良好。该研究为微厚胶层的固化原理提供了理论参考,使恒温状态下微厚胶层固化状态实测成为可能。In order to solve the problem that the solidification stress of the micro thick adhesive layer used for optical component bonding cannot be determined under constant temperature,a dynamic monitoring system for the curing state of the micro thick adhesive layer is designed.Firstly,the monitoring principle of the micro thick adhesive layer is established through the analysis of the generation mechanism and influencing factors of the constant temperature solidification stress in the micro thick adhesive layer,and the scheme of the monitoring system of the curing state of the adhesive layer is formulated.Then the key components of each functional module are designed in detail.The stiffness,deflection and deformation of the supporting structure are calculated in details and analyzed by finite element method,and the assembly model of the whole machine is established based on the assembly pattern.Finally,the performance of the system designed to detect curing state is verified by experiments.The results show that the optimized monitoring system is reasonably designed,and the overall stiffness of the U-shaped structure with 45°support angle is 84%higher than that of the initially selected 7-shaped structure.Using this system for practical application,the characteristic curing tensile stress value in the curing stage of the adhesive layer is monitored and obtained,and the application effect is good.This study provides a theoretical reference for the curing principle of micro thick adhesive layer,and makes it possible to monitor the curing state of micro thick adhesive layer under constant temperature.

关 键 词：微厚胶层 凝固应力 固化状态 监测系统 优化 

分 类 号：TH122[机械工程—机械设计及理论]