HEDP镀铜溶液中聚乙二醇6000含量的测定  

Determination of Content of Polyethylene Glycol 6000 in HEDP Copper Plating Solution

作　　者：杨志业[1] 崔恩状 王进军[1] 李阳 邱媛[1] YANG Zhi-ye;CUI En-zhuang;WANG Jin-jun;LI Yang;QIU Yuan(AVIC,Shenyang 110850,China)

机构地区：[1]沈阳飞机工业(集团)有限公司,辽宁沈阳110850

出　　处：《材料保护》2023年第3期181-182,188,共3页Materials Protection

摘　　要：采用碘沉淀-分光光度法对羟基乙叉二膦酸(HEDP)镀铜溶液中聚乙二醇6000含量的测定进行了研究。结果表明:HEDP镀铜溶液中铜离子会与碘反应干扰测量结果,采用草酸屏蔽铜离子后,可以准确测定HEDP镀铜溶液中聚乙二醇6000含量,标准回收率为98.08%~99.12%,加标回收率为98.24%~98.80%,测定方法误差满足生产控制要求。The content of polyethylene glycol 6000 in Hydroxyethylidene diphosphonic acid(HEDP)copper plating solution was determined and studied by iodine precipitation⁃spectrophotometry.Results showed that the copper ions in HEDP copper plating solution reacted with iodine and interfered with the measurement results.After shielding copper ions with oxalic acid,the content of polyethylene glycol 6000 in HEDP cop⁃per plating solution could be accurately determined.The standard recovery rate was 98.08%~99.12%,and the recovery rate of spiking was 98.24%~98.80%.Moreover,the error of measurement method could meet the requirement of production control.

关 键 词：HEDP镀铜 无氰镀铜 聚乙二醇 分光光度法 测定 

分 类 号：O657[理学—分析化学]