基于温度应力试验的电子产品可靠性仿真分析  

Reliability Simulation Analysis of Typical Electronic Products Based on Temperature Stress Experiments

作　　者：曹敬帅 秦强 张生鹏[1] 杨培 乔洪凯 CAO Jing-shuai;QIN Qiang;ZHANG Sheng-peng;YANG Pei;QIAO Hong-kai(Aerospace Science and Industry Defense Technology Research and Test Center,Beijing 100854;Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,Department of Engineering Mechanics,Tsinghua University,Beijing 100084;206 Institute,Second Academy of China Aerospace,Beijing 100854)

机构地区：[1]航天科工防御技术研究试验中心,北京100854 [2]清华大学工程力学系,热科学与动力工程教育部重点实验室,北京100084 [3]中国航天第二研究院二〇六所,北京100854

出　　处：《环境技术》2023年第3期31-37,43,共8页Environmental Technology

基　　金：国防科工局技术基础科研项目(科工技[2020]148号),项目编号JSZL2019204C001。

摘　　要：本文针对某伺服机构控制器电路板采用故障物理方法进行失效分析,然后在不同温度应力下开展该电子产品温升试验和热仿真,之后基于Coffin-Manson模型进行产品焊点疲劳寿命仿真并求解各元器件寿命分布,最后构建竞争失效模型进行电路板寿命预计。通过温度应力试验得到了关键元器件温升值在(23~31)℃范围内,基于CRAFE热仿真得到了产品各元器件温度,应用Coffin-Manson模型得到了元器件寿命分布,运用竞争失效方法计算了产品失效概率函数,评估了产品工作10年的可靠度为0.94,在可靠度指标为0.9时其工作寿命为12.11年。本文基于温度应力试验和热仿真,通过进行故障物理分析和元器件竞争失效分析有效评估了电子产品工作寿命,对其他类似电子产品可靠性分析提供了一定参考。In this paper,the failure analysis of a servo mechanism controller circuit board is carried out by using the physics of failure analysis method.Then,the temperature rise test and thermal Simulation of electronic products are carried out under different temperature stresses.After that,the fat igue life of the produc t solder Joi nt is Simula ted and the life dis trib ution of each compone nt of the product is solved based on Coffin-Manson model.Finally,a competitive failure model is construeted to predict the circuit board life.Through the temperature stress test,the temperature rise value of the key components in the range of(23〜31)℃ and the component temperature of the product is obtained through CRAFE thermal Simulation.The component life distribution was obtained by Coffin-Manson model,and the failure probability function of the overall product is calculated by the competitive failure met hod,The reliabi lity of the board after*10 years of opera tion is 0.94 and its working life is 12.11 years when the reliability is 0.90.Based on temperature stress tests and thermal Simulations,this paper effectively assesses the working life of electronic products by conducting physical of failures analysis and component competition failure analysis.This paper provides a certain reference for the reliability analysis of other similar electronic products.

关 键 词：电子产品 温度应力试验 热仿真 故障物理 竞争失效 

分 类 号：TG172[金属学及工艺—金属表面处理]