纳秒激光诱导等离子体辅助烧蚀的玻璃表面金属化图案电路研究  

Study on Metallized Pattern Circuit of Glass Surface by Nanosecond Laser-Induced Plasma-Assisted Ablation

作　　者：易根苗[1,2,3] 林新贵 何林[2,3] 梁良 姜长城[2] 江鲲[2,3] YI Genmiao;LIN Xingui;HE Lin;LIANG Liang;JIANG Changcheng;JIANG Kun(School of Intelligent Manufacturing,Guangzhou Panyu Polytechnic,Guangzhou 511483,China;School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510641,China;National Engineering Research Center of Near-net-shape Forming for Metallic Materials,South China University of Technology,Guangzhou 510641,China)

机构地区：[1]广州番禺职业技术学院智能制造学院,广州511483 [2]华南理工大学机械与汽车工程学院,广州510641 [3]华南理工大学、国家金属材料近净成形工程技术研究中心,广州510641

出　　处：《有色金属工程》2023年第4期13-19,共7页Nonferrous Metals Engineering

基　　金：国家自然科学基金资助项目(51575193);广东省普通高校特色创新项目(2020KTSCX283);广州市教育局高校创新团队科研项目(202032787);广州市高校创新创业(就业)教育项目(2020KC002)。

摘　　要：激光诱导等离子体辅助烧蚀(LIPAA)在玻璃表面金属化制备中具有经济、环境友好且高效的优点,本文研究在纳秒激光下以金属铜作为牺牲靶材于玻璃基板上采用LIPAA工艺实现金属化图案电路的可行性。为此,首先对逐行扫描LIPAA制备的玻璃基板上金属化图案电路的导电性能进行详细探讨。针对氧化致其导电率下降的弊端,进一步采用氢气还原对其进行后处理优化,并结合扫描电子显微镜(SEM)和能谱仪(EDS)对电路性能进行分析,揭示了纳秒激光LIPAA方法制备的玻璃金属化图案电路表面的形貌特征及电阻率的变化规律。结果表明,通过激光图案化去除工艺对玻璃表面金属层进行直接烧蚀,可以在玻璃表面制备精细图案化电路。同时,采用化学氢气还原法可克服金属层氧化严重影响电路电阻率这一弊端。化学氢气还原后的平均电阻率仅为8.18×10^(-7)Ω·m,大幅地提升了玻璃表面图案化电路的导电性,具有广阔的应用前景。Laser Induced Plasma Assisted Ablation(LIPAA)has the advantages of economy,environmental friendliness,and high efficiency in the preparation of glass surface metallization.The feasibility of realizing metallized pattern circuit by using LIPAA process on glass substrate with metal copper as sacrificial target under nanosecond laser is studied.Therefore,firstly,the conductivity of metallized pattern circuit on glass substrate prepared by progressive scanning LIPAA is discussed in detail.In view of the disadvantage of the reduction of its conductivity caused by oxidation,the hydrogen reduction was further used to optimize its post-treatment,and the circuit performance was analyzed by combining Scanning Electron Microscopy(SEM)and Energy Dispersive Spectroscopy(EDS),revealing the morphology characteristics and the change rule of resistivity of the surface of the glass metallized pattern circuit prepared by nanosecond laser LIPAA method.The results show that the metal layer on the glass surface can be directly ablated by the laser patterning removal process,and the fine patterned circuit can be prepared on the glass surface.At the same time,the chemical hydrogen reduction method can overcome the disadvantage that the metal layer oxidation seriously affects the circuit resistivity.The average resistivity after chemical hydrogen reduction is only 8.18×10^(-7)Ω·m,which greatly improves the conductivity of the patterned circuit on the glass surface,shows broad application prospects.

关 键 词：激光诱导等离子体辅助烧蚀 表面金属化 电路 导电性 

分 类 号：TG146[一般工业技术—材料科学与工程]