钛铜合金接插件连续电镀及化学镀高磷镍工艺优化  

Process optimization of continuous electroplating and electroless plating of high-phosphorus nickel-phosphorus alloy on titanium-copper alloy connectors

作　　者：杨希明 李晓明 龚俊锋 叶繁 龙磊 杨希军 YANG Ximing;LI Xiaoming;GONG Junfeng;YE Fan;LONG Lei;YANG Xijun(Fuding Precision Components(Shenzhen)Co.,Ltd.,Foxconn Technology Group,Shenzhen 518110,China)

机构地区：[1]富士康科技集团富顶精密组件(深圳)有限公司,广东深圳518110

出　　处：《电镀与涂饰》2023年第7期28-36,共9页Electroplating & Finishing

摘　　要：针对智能手机零件的无磁性要求,采用钛铜合金为基材进行电镀和化学镀高磷镍。通过正交试验对镀前阳极电解脱脂、阴极电化学浸蚀、冲击镀镍,电镀高磷镍和化学镀高磷镍,以及镀后封孔工艺进行优化。研究了镀层P含量对其磁导率的影响,得出镀层P质量分数至少为11%方可满足静态磁导率小于1.003 H/m的要求。目前该连续电镀及化学镀高磷镍工艺已用于实际生产,产品合格率高达99.8%以上。According to the nonmagnetic requirement of smartphone components,electroplating and electroless plating of high-phosphorus Ni–P alloy successively on the surface of Ti–Cu alloy were studied.The process parameters for pretreatments(i.e.anodic electrodegreasing,cathodic electroetching,and nickel strike plating),electroplating and electroless plating of high-phosphorus Ni–P alloy,and sealing as post-treatment were optimized by orthogonal tests.The effect of mass fractions of phosphorus in the coating on its permeability was discussed.It was concluded that the mass fraction of phosphorus in coating should be at least 11%to meet the requirement of static permeability 1.003 H/m below.The continuous high-phosphorus Ni–P alloy electroplating and electroless plating process has been applied to practical production,and more than 99.8%of the products meet the quality requirements.

关 键 词：智能手机 钛铜合金 电镀 化学镀 高磷镍合金 无磁性镀层 

分 类 号：TQ153.2[化学工程—电化学工业]