单层片式瓷介电容器电镀金工艺  

Gold electroplating of single-layered ceramic chip capacitor

作　　者：温占福 罗彦军 聂开付 汤清 WEN Zhanfu;LUO Yanjun;NIE Kaifu;TANG Qing(China Zhenhua Group Yunke Electronics Co.,Ltd.,Guiyang 550018,China)

机构地区：[1]中国振华集团云科电子有限公司,贵州贵阳550018

出　　处：《电镀与涂饰》2023年第7期37-42,共6页Electroplating & Finishing

摘　　要：介绍了单层片式瓷介电容器镀金设备的选择和挂具的设计要点。采用中性微氰镀金溶液电镀金,研究了Au^(+)质量浓度对电镀金允许电流密度范围的影响,以及脉冲参数对镀层表面粗糙度的影响。建议在实际生产中控制参数如下:Au^(+)质量浓度约7 g/L,平均电流密度0.3~0.4 A/dm^(2),频率2000 Hz,占空比20%。介绍了镀液的维护要点,以及镀金层的外观、结合力、厚度、键合强度等性能的要求和检测方法。The selection of equipment and the design of rack for gold electroplating of single-layered ceramic chip capacitors were introduced.A neutral gold electroplating bath with a small amount of cyanide was used.The effect of mass concentration of Au^(+)on the allowable current density range during gold electroplating,and the effects of pulse parameters on the surface roughness of gold coating were studied.It is recommended that the process parameters in actual production be controlled as follows:mass concentration of Au^(+)ca.7 g/L,average current density 0.3-0.4 A/dm^(2),pulse frequency 2000 Hz,and duty cycle 20%.The key points for bath maintenance,the requirements and testing methods of the properties(including appearance,adhesion,thickness,and bonding strength)of gold coating were described.

关 键 词：单层片式瓷介电容器 电镀金 设备 工艺参数 性能检测 

分 类 号：TQ153.18[化学工程—电化学工业]